Datasheet LTM4677 (Analog Devices) - 4

LTM4677
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1) Terminal Voltages:
TOP VIEW 1 2 3 4 5 6 7 8 9 10 11 12 VINn (Note 4), SVIN ... –0.3V to 18V A VOUTn ... –0.3V to 6V GND V + + B OSNS0 , VORB0 .. –0.3V to 6V V V OUT0 GND VIN0 OSNS1, VORB1, INTVCC .. –0.3V to 6V C RUNn, SDA, SCL, ALERT ... –0.3V to 5.5V D FSWPHCFG, VOUTnCFG, VTRIMnCFG, ASEL .. –0.3V to 2.75V V E DD33, GPIOn, SYNC, SHARE_CLK, WP, TSNSna, COMP – – na, COMPnb, VOSNS0 , VORB0 ... –0.3V to 3.6V F SGND .. –0.3V to 0.3V GND G
Temperatures
GND Internal Operating Temperature Range H (Note 2, 3) .. –40°C to 125°C J Storage Temperature Range .. –55°C to 125°C K Peak Solder Reflow Package Body Temperature ... 245°C VOUT1 GND VIN1 L GND M BGA PACKAGE 144-LEAD (16mm × 16mm × 5.01mm) TJMAX = 125°C, θJCtop = 8.8°C/W, θJCbottom = 0.8°C/W, θJB = 1.3°C/W, θJA = 8.3°C/W θ VALUES DETERMINED PER JESD51-12 WEIGHT = 3.5 GRAMS
orDer inForMaTion http://www.linear.com/product/LTM4677#orderinfo PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (See Note 2) DEVICE FINISH CODE
LTM4677EY#PBF SAC305 (RoHS) LTM4677Y e1 BGA 4 –40°C to 125°C LTM4677IY#PBF SAC305 (RoHS) LTM4677Y e1 BGA 4 –40°C to 125°C LTM4677IY SnPb (63/37) LTM4677Y e0 BGA 4 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4677fa 4 For more information www.linear.com/LTM4677 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Functional Diagram Test Circuits Operation Power Module Introduction Power Module Configurability and Readback Data Time-Averaged and Peak Readback Data Power Module Overview EEPROM Serial Interface Device Addressing Fault Detection and Handling Responses to VOUT and IOUT Faults Responses to Timing Faults Responses to SVIN OV Faults Responses to OT/UT Faults Responses to External Faults Fault Logging Bus Timeout Protection PMBus Command Summary PMBus Commands Applications Information VIN to VOUT Step-Down Ratios Input Capacitors Output Capacitors Light Load Current Operation Switching Frequency and Phase Minimum On-Time Considerations Variable Delay Time, Soft-Start and Output Voltage Ramping Digital Servo Mode Soft Off (Sequenced Off) Undervoltage Lockout Fault DETECTION AND HANDLING Open-Drain Pins Phase-Locked Loop and Frequency Synchronization RCONFIG Pin-Straps (External Resistor Configuration Pins) Voltage Selection Connecting the USB to the I2C/SMBus/PMBus Controller to the LTM4677 In System PMBus Communication and Command Processing Thermal Considerations and Output Current Derating Applications Information-Derating Curves EMI Performance Safety Considerations Layout Checklist/Example Typical Applications Appendix A Similarity Between PMBus, SMBus and I2C 2-Wire Interface Appendix B PMBus Serial Digital Interface Appendix C: PMBus Command Details Addressing and Write Protect General Configuration Registers On/Off/Margin PWM Config Voltage Current Temperature Timing Fault Response Fault Sharing Scratchpad Identification Fault Warning and Status Telemetry NVM (EEPROM) Memory Commands Package Description Package Photograph Revision History Typical Application Design Resources Related Parts