Datasheet LTM4622A (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | Dual Ultrathin 2A or Single 4A Step-Down DC/DC μModule Regulator |
| Seiten / Seite | 30 / 2 — ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION (See Pin Functions, … |
| Revision | B |
| Dateiformat / Größe | PDF / 878 Kb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION (See Pin Functions, Pin Configuration Table)
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LTM4622A
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN1, VIN2 ... –0.3V to 22V Operating Internal Temperature Range VOUT ... –0.3V to 16V (Note 2) ... –40°C to 125°C PGOOD1, PGOOD2 ... –0.3V to 18V Storage Temperature Range .. –55°C to 125°C RUN1, RUN2 .. –0.3V to VIN + 0.3V Peak Solder Reflow Body Temperature ...260°C INTVCC, TRACK/SS1, TRACK/SS2 .. –0.3V to 3.6V SYNC/MODE, COMP1, COMP2, FB1, FB2 ... –0.3V to INTVCC
PIN CONFIGURATION (See Pin Functions, Pin Configuration Table)
TOP VIEW TOP VIEW SYNC/ SYNC/ COMP2 GND MODE GND COMP1 COMP2 GND MODE GND COMP1 5 5 PGOOD2 FREQ PGOOD2 FREQ FB2 PGOOD1 FB2 PGOOD1 4 FB1 INTV 4 CC FB1 INTVCC TRACK/SS2 VIN1 V 3 IN1 TRACK/SS1 TRACK/SS2 V 3 IN2 TRACK/SS1 VIN2 RUN2 RUN1 RUN1 2 V RUN2 IN1 2 V V IN1 IN2 GND VIN2 GND V 1 OUT2 VOUT1 V 1 OUT2 VOUT1 A B C D E A B C D E LGA PACKAGE 25-LEAD (6.25mm BGA PACKAGE × 6.25mm × 1.82mm) 25-LEAD (6.25mm × 6.25mm × 2.42mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, WEIGHT = 0.21g WEIGHT = 0.25g
ORDER INFORMATION http://www.linear.com/product/LTM4622A#orderinfo PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (Note 2)
LTM4622AEV#PBF Au (RoHS) LTM4622AV e4 LGA 4 –40°C to 125°C LTM4622AIV#PBF Au (RoHS) LTM4622AV e4 LGA 4 –40°C to 125°C LTM4622AEY#PBF SAC305 (RoHS) LTM4622AY e1 BGA 4 –40°C to 125°C LTM4622AIY#PBF SAC305 (RoHS) LTM4622AY e1 BGA 4 –40°C to 125°C LTM4622AIY SnPb (63/37) LTM4622AY e0 BGA 4 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Pb-free and Non-Pb-free Part Markings: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging Rev B 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Safety Considerations Layout Checklist/Example Package Description Package Photos Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN1, VIN2 ... –0.3V to 22V Operating Internal Temperature Range VOUT ... –0.3V to 16V (Note 2) ... –40°C to 125°C PGOOD1, PGOOD2 ... –0.3V to 18V Storage Temperature Range .. –55°C to 125°C RUN1, RUN2 .. –0.3V to VIN + 0.3V Peak Solder Reflow Body Temperature ...260°C INTVCC, TRACK/SS1, TRACK/SS2 .. –0.3V to 3.6V SYNC/MODE, COMP1, COMP2, FB1, FB2 ... –0.3V to INTVCC
PIN CONFIGURATION (See Pin Functions, Pin Configuration Table)
TOP VIEW TOP VIEW SYNC/ SYNC/ COMP2 GND MODE GND COMP1 COMP2 GND MODE GND COMP1 5 5 PGOOD2 FREQ PGOOD2 FREQ FB2 PGOOD1 FB2 PGOOD1 4 FB1 INTV 4 CC FB1 INTVCC TRACK/SS2 VIN1 V 3 IN1 TRACK/SS1 TRACK/SS2 V 3 IN2 TRACK/SS1 VIN2 RUN2 RUN1 RUN1 2 V RUN2 IN1 2 V V IN1 IN2 GND VIN2 GND V 1 OUT2 VOUT1 V 1 OUT2 VOUT1 A B C D E A B C D E LGA PACKAGE 25-LEAD (6.25mm BGA PACKAGE × 6.25mm × 1.82mm) 25-LEAD (6.25mm × 6.25mm × 2.42mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, WEIGHT = 0.21g WEIGHT = 0.25g
ORDER INFORMATION http://www.linear.com/product/LTM4622A#orderinfo PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (Note 2)
LTM4622AEV#PBF Au (RoHS) LTM4622AV e4 LGA 4 –40°C to 125°C LTM4622AIV#PBF Au (RoHS) LTM4622AV e4 LGA 4 –40°C to 125°C LTM4622AEY#PBF SAC305 (RoHS) LTM4622AY e1 BGA 4 –40°C to 125°C LTM4622AIY#PBF SAC305 (RoHS) LTM4622AY e1 BGA 4 –40°C to 125°C LTM4622AIY SnPb (63/37) LTM4622AY e0 BGA 4 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Pb-free and Non-Pb-free Part Markings: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging Rev B 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Safety Considerations Layout Checklist/Example Package Description Package Photos Design Resources Related Parts