Datasheet LTC1798 (Analog Devices) - 8
| Hersteller | Analog Devices |
| Beschreibung | Micropower Low Dropout References |
| Seiten / Seite | 10 / 8 — PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise … |
| Dateiformat / Größe | PDF / 848 Kb |
| Dokumentensprache | Englisch |
PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted. S8 Package
Modelllinie für dieses Datenblatt
- LTC1798CS8-2.5#PBF LTC1798CS8-2.5#PBF LTC1798CS8-2.5#TRPBF LTC1798CS8-2.5#TRPBF LTC1798CS8-3#PBF LTC1798CS8-3#PBF LTC1798CS8-3#TRPBF LTC1798CS8-3#TRPBF LTC1798CS8-4.1#PBF LTC1798CS8-4.1#PBF LTC1798CS8-4.1#TRPBF LTC1798CS8-4.1#TRPBF LTC1798CS8-5#PBF LTC1798CS8-5#PBF LTC1798CS8-5#TRMPBF LTC1798CS8-5#TRPBF LTC1798CS8-5#TRPBF
Textversion des Dokuments
LTC1798 Series
PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted. S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) .045 .005 NOTE 3 .050 BSC 8 7 6 5 .245 MIN .160 .005 .150 – .157 .228 – .244 (3.810 – 3.988) (5.791 – 6.197) NOTE 3 .030 .005 TYP 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT .010 – .020 ¥ 45∞ (0.254 – 0.508) .053 – .069 (1.346 – 1.752) .008 – .010 .004 – .010 0– 8 TYP (0.203 – 0.254) (0.101 – 0.254) .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: INCHES TYP BSC 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303 1798fc 8 Document Outline FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION ORDER INFORMATION AVAILABLE OPTIONS ELECTRICAL CHARACTERISTICS TYPICAL PERFORMANCE CHARACTERISTICS PIN FUNCTIONS BLOCK DIAGRAM APPLICATIONS INFORMATION PACKAGE DESCRIPTION REVISION HISTORY TYPICAL APPLICATION RELATED PARTS
PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted. S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) .045 .005 NOTE 3 .050 BSC 8 7 6 5 .245 MIN .160 .005 .150 – .157 .228 – .244 (3.810 – 3.988) (5.791 – 6.197) NOTE 3 .030 .005 TYP 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT .010 – .020 ¥ 45∞ (0.254 – 0.508) .053 – .069 (1.346 – 1.752) .008 – .010 .004 – .010 0– 8 TYP (0.203 – 0.254) (0.101 – 0.254) .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: INCHES TYP BSC 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303 1798fc 8 Document Outline FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION ORDER INFORMATION AVAILABLE OPTIONS ELECTRICAL CHARACTERISTICS TYPICAL PERFORMANCE CHARACTERISTICS PIN FUNCTIONS BLOCK DIAGRAM APPLICATIONS INFORMATION PACKAGE DESCRIPTION REVISION HISTORY TYPICAL APPLICATION RELATED PARTS