Datasheet ADR225-KGD-CHIPS (Analog Devices) - 5
| Hersteller | Analog Devices |
| Beschreibung | High Temperature, Low Drift, Micropower, 2.5V Reference |
| Seiten / Seite | 6 / 5 — Known Good Die. ADR225-KGD-CHIPS. PIN CONFIGURATION AND FUNCTION … |
| Dateiformat / Größe | PDF / 158 Kb |
| Dokumentensprache | Englisch |
Known Good Die. ADR225-KGD-CHIPS. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. OUT. FORCE. VOUT. SENSE. GND
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Known Good Die ADR225-KGD-CHIPS PIN CONFIGURATION AND FUNCTION DESCRIPTIONS NC V NC OUT 1 8 7b FORCE VS 2a VOUT 7a V SENSE S 2b 6 NC GND 3 4 5
002
NC NC
14153- Figure 2. Pad Configuration
Table 3. Pad Function Descriptions1 Pad No. X-Axis (μm) Y-Axis (μm) Mnemonic Description
1 −368 +587 NC No Connect. Do not connect to this pad. 2a −362 +423 V Input. The input must be connected to both V pads. S S 2b −360 +18 V Input. The input must be connected to both V pads. S S 3 −362 −401 GND Ground. 4 −149 −525 NC No Connect. Do not connect to this pad. 5 +345 −577 NC No Connect. Do not connect to this pad. 6 +368 −256 NC No Connect. Do not connect to this pad. 7a +330 +36 V SENSE Sense Output. The output must be connected to both V SENSE and V FORCE OUT OUT OUT pads. 7b +339 +576 V FORCE Force Output. The output must be connected to both V SENSE and V FORCE OUT OUT OUT pads. 8 −122 +576 NC No Connect. Do not connect to this pad. 1 The die center is the reference location at 0.0 µm × 0.0 μm. The pad coordinates are to the center of each pad. Rev. 0 | Page 5 of 6 Document Outline FEATURES APPLICATIONS METAL MASK DIE IMAGE GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS ORDERING GUIDE
002
NC NC
14153- Figure 2. Pad Configuration
Table 3. Pad Function Descriptions1 Pad No. X-Axis (μm) Y-Axis (μm) Mnemonic Description
1 −368 +587 NC No Connect. Do not connect to this pad. 2a −362 +423 V Input. The input must be connected to both V pads. S S 2b −360 +18 V Input. The input must be connected to both V pads. S S 3 −362 −401 GND Ground. 4 −149 −525 NC No Connect. Do not connect to this pad. 5 +345 −577 NC No Connect. Do not connect to this pad. 6 +368 −256 NC No Connect. Do not connect to this pad. 7a +330 +36 V SENSE Sense Output. The output must be connected to both V SENSE and V FORCE OUT OUT OUT pads. 7b +339 +576 V FORCE Force Output. The output must be connected to both V SENSE and V FORCE OUT OUT OUT pads. 8 −122 +576 NC No Connect. Do not connect to this pad. 1 The die center is the reference location at 0.0 µm × 0.0 μm. The pad coordinates are to the center of each pad. Rev. 0 | Page 5 of 6 Document Outline FEATURES APPLICATIONS METAL MASK DIE IMAGE GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS ORDERING GUIDE