Datasheet ADuM6400, ADuM6401, ADuM6402, ADuM6403, ADuM6404 (Analog Devices) - 8

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ADuM6400/ADuM6401/ADuM6402/ADuM6403/ADuM6404 Data Sheet Table 13. Input and Output Characteristics Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DC SPECIFICATIONS Logic High Input Threshold VIH 0.7 × VISO or V 0.7 × VDD1 Logic Low Input Threshold VIL 0.3 × VISO or V 0.3 × VDD1 Logic High Output Voltages VOH VDD1 − 0.2 or VDD1 or VISO V IOx = −20 μA, VIx = VIxH VISO − 0.2 VDD1 − 0.5 or VDD1 − 0.2 or V IOx = −4 mA, VIx = VIxH VISO − 0.5 VISO − 0.2 Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = VIxL 0.0 0.4 V IOx = 4 mA, VIx = VIxL Undervoltage Lockout UVLO VDD1, VDDL, VISO supplies Positive-Going Threshold VUV+ 2.7 V Negative-Going Threshold VUV− 2.4 V Hysteresis VUVH 0.3 V Input Currents per Channel II −10 +0.01 +10 μA 0 V ≤ VIx ≤ VDDx AC SPECIFICATIONS Output Rise/Fall Time tR/tF 2.5 ns 10% to 90% Common-Mode Transient |CM| 25 35 kV/μs VIx = VDD1 or VISO, VCM = 1000 V, Immunity1 transient magnitude = 800 V Refresh Rate fr 1.0 Mbps 1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.7 × VDD1 or 0.7 × VISO for a high input or VO < 0.3 × VDD1 or 0.3 × VISO for a low input. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
PACKAGE CHARACTERISTICS Table 14. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
RESISTANCE AND CAPACITANCE Resistance (Input-to-Output)1 RI-O 1012 Ω Capacitance (Input-to-Output)1 CI-O 2.2 pF f = 1 MHz Input Capacitance2 CI 4.0 pF IC Junction-to-Ambient Thermal θJA 45 °C/W Thermocouple is located at the center of Resistance the package underside; test conducted on a 4-layer board with thin traces3 THERMAL SHUTDOWN Thermal Shutdown Threshold TSSD 150 °C TJ rising Thermal Shutdown Hysteresis TSSD-HYS 20 °C 1 This device is considered a 2-terminal device; Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together. 2 Input capacitance is from any input data pin to ground. 3 Refer to the Thermal Analysi sect s ion for thermal model definitions. Rev. A | Page 8 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS—5 V PRIMARY INPUT SUPPLY/5 V SECONDARY ISOLATED SUPPLY ELECTRICAL CHARACTERISTICS—3.3 V PRIMARY INPUT SUPPLY/3.3 V SECONDARY ISOLATED SUPPLY ELECTRICAL CHARACTERISTICS—5 V PRIMARY INPUT SUPPLY/3.3 V SECONDARY ISOLATED SUPPLY PACKAGE CHARACTERISTICS REGULATORY INFORMATION INSULATION AND SAFETY-RELATED SPECIFICATIONS INSULATION CHARACTERISTICS IEC 60747-5-2 (VDE 0884 Part 2):2003-01 and DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 Thermal Derating Curve RECOMMENDED OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TRUTH TABLE TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY APPLICATIONS INFORMATION PCB LAYOUT START-UP BEHAVIOR EMI CONSIDERATIONS PROPAGATION DELAY PARAMETERS DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY POWER CONSUMPTION CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION POWER CONSIDERATIONS THERMAL ANALYSIS INSULATION LIFETIME OUTLINE DIMENSIONS ORDERING GUIDE