Datasheet HMC447LC3 (Analog Devices) - 4
| Hersteller | Analog Devices |
| Beschreibung | SMT SMT GaAs HBT MMIC DIVIDE-BY-4, 10-26 GHz |
| Seiten / Seite | 8 / 4 — HMC447LC3. SMT GaAs HBT MMIC. DIVIDE-BY-4, 10 - 26 GHz. Outline Drawing. … |
| Dateiformat / Größe | PDF / 401 Kb |
| Dokumentensprache | Englisch |
HMC447LC3. SMT GaAs HBT MMIC. DIVIDE-BY-4, 10 - 26 GHz. Outline Drawing. Package Information
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HMC447LC3
v04.0514
SMT GaAs HBT MMIC DIVIDE-BY-4, 10 - 26 GHz Outline Drawing
T M S - S R O T C E T E NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA S & D 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES R GOLD OVER 50 MICROINCHES MINIMUM NICKEL. E 3. DIMENSIONS ARE IN INCHES [MILLIMETERS] 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. ID 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C- . 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE IV SOLDERED TO PCB RF GROUND. Y D C N E U
Package Information
Q Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] E HMC447LC3 Alumina, White Gold over Nickel MSL3 [1] H447 R XXXX F [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
4
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D
v04.0514
SMT GaAs HBT MMIC DIVIDE-BY-4, 10 - 26 GHz Outline Drawing
T M S - S R O T C E T E NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA S & D 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES R GOLD OVER 50 MICROINCHES MINIMUM NICKEL. E 3. DIMENSIONS ARE IN INCHES [MILLIMETERS] 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. ID 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C- . 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE IV SOLDERED TO PCB RF GROUND. Y D C N E U
Package Information
Q Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] E HMC447LC3 Alumina, White Gold over Nickel MSL3 [1] H447 R XXXX F [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
4
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D