Datasheet ADF5002 (Analog Devices) - 3

ADF5002 SPECIFICATIONS
VDD1 = VDD2 = 3.3 V ± 10%, GND = 0 V; dBm referred to 50 Ω; TA = TMIN to TMAX, unless otherwise noted. Operating temperature range is −40°C to +105°C.
Table 1. Parameter Min Typ Max Unit Test Conditions/Comments
RF CHARACTERISTICS Input Frequency 4 18 GHz RF Input Sensitivity −10 +10 dBm 4 GHz to 18 GHz Output Power −10 −5 dBm Single-ended output connected into a 50 Ω load −7 −2 dBm Differential outputs connected into a 100 Ω differential load Output Voltage Swing 200 330 mV p-p Peak-to-peak voltage swing on each single-ended output, connected into a 50 Ω load 400 660 mV p-p Peak-to-peak voltage swing on differential output, connected into a 100 Ω differential load 1000 mV p-p Peak-to-peak voltage swing on each single-ended output, no load condition Phase Noise −153 dBc/Hz Input frequency (fIN) = 12 GHz, offset = 100 kHz Reverse Leakage −60 dBm RF input power (PIN) = 0 dBm, RFOUT = 4 GHz Second Harmonic Content −38 dBc Third Harmonic Content −12 dBc Fourth Harmonic Content −20 dBc Fifth Harmonic Content −19 dBc CE INPUT Input High Voltage, VIH 2.2 V Input Low Voltage, VIL 0.3 V POWER SUPPLIES Voltage Supply 3.0 3.3 3.6 V IDD (IDD1 + IDD2) Active 30 60 mA CE is high Power-Down 7 25 mA CE is low Rev. 0 | Page 3 of 12 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS EVALUATION BOARD PCB PCB MATERIAL STACK-UP BILL OF MATERIALS APPLICATION CIRCUIT OUTLINE DIMENSIONS ORDERING GUIDE