Datasheet HMC631LP3, 631LP3E (Analog Devices) - 4
| Hersteller | Analog Devices |
| Beschreibung | GaAs HBT Vector Modulator 1.8 -2.7 GHz |
| Seiten / Seite | 8 / 4 — HMC631LP3 / 631LP3E. GaAs HBT VECTOR. MODULATOR 1.8 - 2.7 MHz. Typical … |
| Dateiformat / Größe | PDF / 848 Kb |
| Dokumentensprache | Englisch |
HMC631LP3 / 631LP3E. GaAs HBT VECTOR. MODULATOR 1.8 - 2.7 MHz. Typical Supply Current vs. Vcc. Absolute Maximum Ratings
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Textversion des Dokuments
HMC631LP3 / 631LP3E
v00.1007
GaAs HBT VECTOR MODULATOR 1.8 - 2.7 MHz Typical Supply Current vs. Vcc Absolute Maximum Ratings
Vcc (V) Icc (mA) RF Input (Vcc = +8V) 27 dBm 7.6 88 Supply Voltage (Vcc) +10V 8.0 93 I & Q Input -0.5V to +5V 8.4 99 Junction Temperature (Tc) 135 °C Continuous Pdiss (T = 85°C) Note: 1.7 W (Derate 34 mW/°C above 85°C) Modulator will operate over full voltage range shown above. Thermal Resistance (R ) th 29.6 °C/W (junction to ground paddle) Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE Operating Temperature -40 to +85 °C OBSERVE HANDLING PRECAUTIONS 10 T
Outline Drawing
- SM S R O T A L U MOD NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] 631 HMC631LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] 631 HMC631LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Information furnishe F d o b r pr y Analic o e g , D d evi e ce li s v i e s brey li , a eve n d t d to p o be acc luac rat e o e an r d d rele ia rs ble , p . Hole we a ves r, e n c o ont Fo ac r p t H rice i, tt dit ele M iveryic , r a owa nd to ve C plac o e r o p rdo e r r at s: i Ao n n al:og Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other 20 Alpha Road, Chelmsford, MA 01824 Phone One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No : 978-250-3343 Fax: 978-250-3373 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Phone: 781-329-4700 • Order online at www.analog.com
10 - 61
Order On Trademarks and registered trademarks are the property of their respective owners. -line at www.hi A tt p i pte lic.c atiom n Support: Phone: 1-800-ANALOG-D
v00.1007
GaAs HBT VECTOR MODULATOR 1.8 - 2.7 MHz Typical Supply Current vs. Vcc Absolute Maximum Ratings
Vcc (V) Icc (mA) RF Input (Vcc = +8V) 27 dBm 7.6 88 Supply Voltage (Vcc) +10V 8.0 93 I & Q Input -0.5V to +5V 8.4 99 Junction Temperature (Tc) 135 °C Continuous Pdiss (T = 85°C) Note: 1.7 W (Derate 34 mW/°C above 85°C) Modulator will operate over full voltage range shown above. Thermal Resistance (R ) th 29.6 °C/W (junction to ground paddle) Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE Operating Temperature -40 to +85 °C OBSERVE HANDLING PRECAUTIONS 10 T
Outline Drawing
- SM S R O T A L U MOD NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] 631 HMC631LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] 631 HMC631LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Information furnishe F d o b r pr y Analic o e g , D d evi e ce li s v i e s brey li , a eve n d t d to p o be acc luac rat e o e an r d d rele ia rs ble , p . Hole we a ves r, e n c o ont Fo ac r p t H rice i, tt dit ele M iveryic , r a owa nd to ve C plac o e r o p rdo e r r at s: i Ao n n al:og Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other 20 Alpha Road, Chelmsford, MA 01824 Phone One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No : 978-250-3343 Fax: 978-250-3373 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Phone: 781-329-4700 • Order online at www.analog.com
10 - 61
Order On Trademarks and registered trademarks are the property of their respective owners. -line at www.hi A tt p i pte lic.c atiom n Support: Phone: 1-800-ANALOG-D