Datasheet 6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-0611, HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661 (Broadcom) - 6
| Hersteller | Broadcom |
| Beschreibung | High CMR, High Speed TTL Compatible Optocouplers 6N137, HCPL-26xx/06xx/4661, HCNW137/26x1 |
| Seiten / Seite | 29 / 6 — Package Outline Drawings. 8-pin DIP Package1 (6N137, HCPL-2601/11/30/31, … |
| Dateiformat / Größe | PDF / 1.3 Mb |
| Dokumentensprache | Englisch |
Package Outline Drawings. 8-pin DIP Package1 (6N137, HCPL-2601/11/30/31, HCPL-4661). 9.65 ± 0.25. 7.62 ± 0.25. (0.380 ± 0.010)
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6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-0611, Package Outline Drawings HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661 Data Sheet
Package Outline Drawings 8-pin DIP Package1 (6N137, HCPL-2601/11/30/31, HCPL-4661) 9.65 ± 0.25 7.62 ± 0.25 (0.380 ± 0.010) (0.300 ± 0.010) 8 7 6 5 6.35 ± 0.25 DEVICE PART NUMBER (0.250 ± 0.010) AVAGO A NNNN Z LEAD-FREE YYWW DATE CODE • TEST RATING CODE UL LOGO EEE P SPECIAL PROGRAM CODE LOT ID PIN 1 1 2 3 4 1.78 (0.070) MAX. 1.19 (0.047) MAX. + 0.076 5° TYP. 0.254 - 0.051 + 0.003) 3.56 ± 0.13 4.70 (0.185) MAX. (0.010 - 0.002) (0.140 ± 0.005) 0.51 (0.020) MIN. 2.92 (0.115) MIN. DIMENSIONS IN MILLIMETERS (INCHES). *MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 1.080 ± 0.320 0.65 (0.025) MAX. "V" = OPTION 060 (0.043 ± 0.013) OPTION NUMBERS 300 AND 500 NOT MARKED. 2.54 ± 0.25 (0.100 ± 0.010) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1. JEDEC Registered Data (for 6N137 only). Avago Technologies - 6 - Document Outline High CMR, High Speed TTL Compatible Optocouplers Description Functional Diagram Features Applications Selection Guide Ordering Information Schematic Package Outline Drawings 8-pin DIP Package (6N137, HCPL-2601/11/30/31, HCPL-4661) 8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661) Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) Reflow Soldering Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-06xx Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-26xx; 46xx; 6N13x Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW137/2601/2611 Only) Absolute Maximum Ratings (No Derating Required up to 85 °C) Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew
Package Outline Drawings 8-pin DIP Package1 (6N137, HCPL-2601/11/30/31, HCPL-4661) 9.65 ± 0.25 7.62 ± 0.25 (0.380 ± 0.010) (0.300 ± 0.010) 8 7 6 5 6.35 ± 0.25 DEVICE PART NUMBER (0.250 ± 0.010) AVAGO A NNNN Z LEAD-FREE YYWW DATE CODE • TEST RATING CODE UL LOGO EEE P SPECIAL PROGRAM CODE LOT ID PIN 1 1 2 3 4 1.78 (0.070) MAX. 1.19 (0.047) MAX. + 0.076 5° TYP. 0.254 - 0.051 + 0.003) 3.56 ± 0.13 4.70 (0.185) MAX. (0.010 - 0.002) (0.140 ± 0.005) 0.51 (0.020) MIN. 2.92 (0.115) MIN. DIMENSIONS IN MILLIMETERS (INCHES). *MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 1.080 ± 0.320 0.65 (0.025) MAX. "V" = OPTION 060 (0.043 ± 0.013) OPTION NUMBERS 300 AND 500 NOT MARKED. 2.54 ± 0.25 (0.100 ± 0.010) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1. JEDEC Registered Data (for 6N137 only). Avago Technologies - 6 - Document Outline High CMR, High Speed TTL Compatible Optocouplers Description Functional Diagram Features Applications Selection Guide Ordering Information Schematic Package Outline Drawings 8-pin DIP Package (6N137, HCPL-2601/11/30/31, HCPL-4661) 8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661) Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) Reflow Soldering Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-06xx Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-26xx; 46xx; 6N13x Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW137/2601/2611 Only) Absolute Maximum Ratings (No Derating Required up to 85 °C) Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew