Datasheet AD8643 (Analog Devices) - 3

1.4 Thermal characteristics. Thermal resistance Case outline θJA θJC Unit Case X 120 36 °C/W 2. APPLICABLE DOCUMENTS JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEP95 – Registered and Standard Outlines for Semiconductor Devices (Copies of these documents are available online at http:/www.jedec.org or from JEDEC – Solid State Technology Association, 3103 North 10th Street, Suite 240–S, Arlington, VA 22201.) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as follows: A. Manufacturer’s name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
DLA LAND AND MARITIME
SIZE CODE IDENT NO. DWG NO.
COLUMBUS, OHIO A 16236 V62/12653
REV PAGE 3 Document Outline DESCRIPTION REV REV PMIC N/A TITLE SIZE A V62/12653 REV