Datasheet MIC4609 (Microchip) - 5

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MIC4609 1.0 ELECTRICAL Operating Ratings (1) CHARACTERISTICS
Supply Voltage (VDD) ... +10V to +20V Voltage on xHS (continuous) ... -1V to +600V
Absolute Maximum Ratings †
Voltage on xHS (repetitive transient) ... -5V to +600V HS Slew Rate .. 50V/ns Supply Voltage (VDD, VXHB - VXHS) .. -0.3V to +25V Voltage on xHB ...VXHS + 10V to VXHS + 20V Input Voltages (VXLI, VXHI, VEN) .. -0.3V to VDD and/or ..VDD - 1V to VDD + 600V Voltage on LO (VXLO) .. -0.3V to VDD Junction Temperature (TJ) ... -40°C to +125°C Voltage on HO (VXHO) ...VHS - 0.3V to VHB Junction Thermal Resistance (JA).. -40°C to +125°C Voltage on HS .. -5V to +630V SOIC Wide 28LD .. 53°C/W Voltage on HB ...+655V
Note 1:
The device is not guaranteed to function Storage Temperature ...-60°C to +150°C outside its operating rating. ESD Rating HBM .. 2kV CDM.. 1.5 kV
† Notice:
Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
AC/DC ELECTRICAL CHARACTERISTICS (Note 1, 2 ) Electrical Specifications:
Unless otherwise indicated, VDD = VxHB = 20V, VEN = 5V, VSS = VxHS = 0V; No load on xLO or xHO, TA = +25°C.
Bold
values indicate -40°C TJ +125°C.
Parameter Sym. Min. Typ. Max. Unit Conditions Supply Current
VDD Quiescent Current IDD — 150
250
µA xLI = xHI = 0V VDD Shutdown Current IDDSH — 0.1
10
µA EN = 0V with HS = floating or ground VDD Operating Current IDDO — 240
350
µA f = 20 kHz Total xHB Quiescent Current IxHB — 81
180
µA xLI = xHI = 0V or xLI = 0V and xHI = 5V Total xHB Operating Current IxHBO — 600
1500
µA f = 20 kHz High-Side Leakage Current ILxHB — 1
10
µA VxHB = VxHS = 600V
Input (TTL: xLI, xHI, EN)
Low-Level Input Voltage VIL — —
0.8
V High-Level Input Voltage VIH
2.2
— — V Input Voltage Hysteresis VHYS — 0.2 — V Input Pull-Down Resistance RI
100
370
500
k For xLI and xHI only
(Note 3 ) Undervoltage Protection
VDD Falling Threshold VDDR
7
8
9
V VDD Threshold Hysteresis VDDH — 0.5 — V xHB Falling Threshold VxHBR
7
8
9
V xHB Threshold Hysteresis VxHBH — 0.5 — V
Note 1:
Specification for packaged product only.
2:
The x in the suffix of a pin name designates any of the three phases, e.g., xHS refers to either AHS, BHS or CHS.
3:
Enable resistance is typical only and is not production tested.  2016 Microchip Technology Inc. DS20005531A-page 5 Document Outline 600V 3-Phase MOSFET/IGBT Driver Features Typical Applications General Description Package Type Functional Block Diagram MIC4609 – Top Level Circuit Functional Block Diagram MIC4609 – Phase x Drive Circuit Typical Application Circuit MIC4609 – 300V, 3-Phase Motor Driver 1.0 Electrical Characteristics Absolute Maximum Ratings AC/DC Electrical Characteristics Temperature Characteristics 2.0 Typical Performance Curves FIGURE 2-1: VDD Quiescent Current vs. VDD Voltage. FIGURE 2-2: VDD Quiescent Current vs. Temperature. FIGURE 2-3: VHB Quiescent Current vs. VHB Voltage. FIGURE 2-4: VHB Quiescent Current vs. Temperature. FIGURE 2-5: VDD+HB Shutdown Current vs. Voltage. FIGURE 2-6: VDD+HB Shutdown Current vs. Temperature. FIGURE 2-7: VDD+HB Shutdown Current vs. Voltage. FIGURE 2-8: VDD+HB Shutdown Current vs. Temperature. FIGURE 2-9: VDD Operating Current vs. Frequency. FIGURE 2-10: VHB Operating Current vs. Frequency – One Phase. FIGURE 2-11: HO Output Sink ON-Resistance vs. VDD. FIGURE 2-12: HO Output Sink ON-Resistance vs. Temperature. FIGURE 2-13: LO Output Sink ON-Resistance vs. VDD. FIGURE 2-14: LO Output Sink ON-Resistance vs. Temperature. FIGURE 2-15: HO Output Source ON-Resistance vs. VDD. FIGURE 2-16: HO Output Source ON-Resistance vs. Temperature. FIGURE 2-17: LO Output Source ON-Resistance vs. VDD. FIGURE 2-18: LO Output Source ON-Resistance vs. Temperature. FIGURE 2-19: VDD/VHB ULVO vs. Temperature. FIGURE 2-20: Propagation Delay vs. VDD Voltage. FIGURE 2-21: Propagation Delay vs. Temperature. FIGURE 2-22: HO Rise Time vs. VDD Voltage. FIGURE 2-23: HO Fall Time vs. VDD Voltage. FIGURE 2-24: LO Rise Time vs. VDD Voltage. FIGURE 2-25: LO Fall Time vs. VDD Voltage. FIGURE 2-26: Rise/Fall Time vs. Temperature (VDD = 10V). FIGURE 2-27: Rise/Fall Time vs. Temperature (VDD = 20V). FIGURE 2-28: Dead Time vs. VDD Voltage. FIGURE 2-29: Dead Time vs. Temperature (VDD = 10V). FIGURE 2-30: Dead Time vs. Temperature (VDD = 20V). FIGURE 2-31: Overcurrent Threshold vs. VDD Voltage. FIGURE 2-32: Overcurrent Threshold vs. Temperature. FIGURE 2-33: Overcurrent Propagation Delay vs. VDD Voltage. FIGURE 2-34: Overcurrent Propagation Delay vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 4.0 Functional Description 4.1 UVLO Protection 4.2 Startup and UVLO FIGURE 4-1: Startup and Fault Timing Diagram. TABLE 4-1: Operational Truth Table 4.3 Enable Inputs 4.4 Input Stage FIGURE 4-2: Input Stage Block Diagram. FIGURE 4-3: Minimum Pulse-Width Diagram. 4.5 Dead Time and Anti-Shoot-Through Protection FIGURE 4-4: Dead Time, Propagation Delay, and Rise/Fall-Time Diagram. 4.6 Low-Side Driver Output Stage FIGURE 4-5: Low-Side Driver Block Diagram. 4.7 High-Side Driver and Bootstrap Circuit FIGURE 4-6: High-Side Driver and Bootstrap Circuit Block Diagram. FIGURE 4-7: MIC4609 Motor Driver Typical Application – Phase A. 4.8 Overcurrent Protection Circuitry FIGURE 4-8: Overcurrent Fault Sequence. EQUATION 4-1: 5.0 Application Information 5.1 Bootstrap Circuit FIGURE 5-1: MIC4609 – Bootstrap Circuit. EQUATION 5-1: EQUATION 5-2: 5.2 HS Node Clamp FIGURE 5-2: Negative HS Pin Voltage. 5.3 Power Dissipation Considerations FIGURE 5-3: MIC4609 High-Side Driving an External IGBT. FIGURE 5-4: Typical Gate Charge vs. VGE. EQUATION 5-3: EQUATION 5-4: EQUATION 5-5: EQUATION 5-6: EQUATION 5-7: 5.4 Decoupling Capacitor Selection 5.5 Grounding, Component Placement and Circuit Layout FIGURE 5-5: Turn-On Current Paths. FIGURE 5-6: Turn-Off Current Paths. 6.0 Packaging Information Appendix A: Revision History Revision A (March 2016) Product Identification System Trademarks Worldwide Sales and Service