Datasheet AMP03 (Analog Devices) - 9

HerstellerAnalog Devices
BeschreibungPrecision, Unity-Gain Differential Amplifier Data Sheet
Seiten / Seite9 / 9 — AMP03. OUTLINE DIMENSIONS. 8-Lead Small Outline Package [SOIC]. 8-Lead …
RevisionF
Dateiformat / GrößePDF / 292 Kb
DokumentenspracheEnglisch

AMP03. OUTLINE DIMENSIONS. 8-Lead Small Outline Package [SOIC]. 8-Lead Plastic Dual In-Line Package [PDIP]. [S Suffix]

AMP03 OUTLINE DIMENSIONS 8-Lead Small Outline Package [SOIC] 8-Lead Plastic Dual In-Line Package [PDIP] [S Suffix]

Textversion des Dokuments

AMP03 OUTLINE DIMENSIONS 8-Lead Small Outline Package [SOIC] 8-Lead Plastic Dual In-Line Package [PDIP] [S Suffix] [P Suffix] (R-8) (N-8)
Dimensions shown in millimeters and (inches) Dimensions shown in inches and (millimeters)
5.00 (0.1968) 0.375 (9.53) 4.80 (0.1890) 0.365 (9.27) 0.355 (9.02) 8 5 4.00 (0.1574) 6.20 (0.2440) 8 5 0.295 (7.49) 3.80 (0.1497) 1 4 5.80 (0.2284) 0.285 (7.24)
C00249–0–12/03(F)
1 4 0.275 (6.98) 0.325 (8.26) 1.27 (0.0500) 0.50 (0.0196) 0.310 (7.87) 1.75 (0.0688)

45

0.100 (2.54) BSC 0.25 (0.0099) 0.300 (7.62) 0.150 (3.81) BSC 1.35 (0.0532) 0.135 (3.43) 0.25 (0.0098) 0.015 0.120 (3.05) 0.10 (0.0040) 0.180 (0.38) 8 0.51 (0.0201)

(4.57) MIN 0 COPLANARITY

1.27 (0.0500) MAX 0.31 (0.0122) 0.25 (0.0098) SEATING 0.10 0.015 (0.38) 0.17 (0.0067) 0.40 (0.0157) PLANE 0.150 (3.81) SEATING 0.010 (0.25) 0.130 (3.30) PLANE 0.008 (0.20) COMPLIANT TO JEDEC STANDARDS MS-012AA 0.110 (2.79) 0.060 (1.52) CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR 0.022 (0.56) 0.050 (1.27) REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN 0.018 (0.46) 0.045 (1.14) 0.014 (0.36) COMPLIANT TO JEDEC STANDARDS MO-095AA CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN 8-Lead Metal Can [TO-99] [J Suffix] (H-08B)
Dimensions shown in inches and (millimeters)
REFERENCE PLANE 0.5000 (12.70) MIN 0.1850 (4.70) 0.2500 (6.35) MIN 0.1650 (4.19) 0.1000 (2.54) BSC 0.0500 (1.27) MAX 0.1600 (4.06) 0.1400 (3.56) 5 6 4 0.0450 (1.14) 0.2000 0.0270 (0.69) (5.08) 3 7 BSC 0.3700 (9.40) 0.3350 (8.51) 0.3350 (8.51) 0.3050 (7.75) 2 8 1 0.0190 (0.48) 0.1000 (2.54) 0.0160 (0.41) BSC 0.0400 (1.02) MAX 0.0340 (0.86) 0.0210 (0.53) 0.0280 (0.71) 0.0400 (1.02) 0.0160 (0.41) 0.0100 (0.25) 45 BSC BASE & SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-002AK CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN Revision History Location Page 12/03—Data Sheet changed from REV. E to REV. F.
Changes to ELECTRICAL CHARACTERISTICS . 2 Changes to ORDERING GUIDE . 3 Updated OUTLINE DIMENSIONS . 7 –8– REV. F Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PIN CONNECTIONS SPECIFICATIONS WAFER TEST LIMITS ABSOLUTE MAXIMUM RATINGS ORDERING GUIDE DICE CHARACTERISTICS BURN-IN CIRCUIT SLEW RATE TEST CIRCUIT Typical Performance Characteristics APPLICATION CIRCUITS APPLICATIONS INFORMATION MAINTAINING COMMON-MODE REJECTION OUTLINE DIMENSIONS Revision History