Datasheet ADXL312 (Analog Devices) - 5

HerstellerAnalog Devices
Beschreibung3-Axis, ±1.5 g/±3 g/±6 g/±12 g Digital Accelerometer
Seiten / Seite33 / 5 — ADXL312. Data Sheet. Parameter. Test Conditions/Comments. Min. Typ. Max. …
RevisionB
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DokumentenspracheEnglisch

ADXL312. Data Sheet. Parameter. Test Conditions/Comments. Min. Typ. Max. Unit

ADXL312 Data Sheet Parameter Test Conditions/Comments Min Typ Max Unit

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ADXL312 Data Sheet Parameter Test Conditions/Comments Min Typ Max Unit
POWER SUPPLY Operating Voltage Range (VS) 2.0 3.6 V Interface Voltage Range (VDD I/O) 1.7 VS V Supply Current Data rate > 100 Hz 100 170 300 µA Data rate < 10 Hz 30 55 110 µA Standby Mode Leakage Current T = 25°C 0.1 2 µA Over entire operating temperature range 17 µA Turn-On (Wake-Up) Time5 1.4 ms TEMPERATURE Operating Temperature Range −40 +105 °C 1 All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. 2 Cross-axis sensitivity is defined as coupling between any two axes. 3 Bandwidth is half the output data rate. 4 Self-test change is defined as the output (g) when the SELF_TEST bit = 1 (in the DATA_FORMAT register) minus the output (g) when the SELF_TEST bit = 0 (in the DATA_FORMAT register). Due to device filtering, the output reaches its final value after 4 × τ when enabling or disabling self-test, where τ = 1/(data rate). 5 Turn-on and wake-up times are determined by the user-defined bandwidth. At a 100 Hz data rate, the turn-on and wake-up times are each approximately 11.1 ms. For other data rates, the turn-on and wake-up times are each approximately τ + 1.1 in milliseconds, where τ = 1/(data rate). Rev. B | Page 4 of 32 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Power Sequencing Power Savings Power Modes Autosleep Mode Standby Mode Serial Communications Serial Port I/O Default states SPI Preventing Bus Traffic Errors I2C Interrupts DATA_READY Activity Inactivity Watermark Overrun FIFO Bypass Mode FIFO Mode Stream Mode Trigger Mode Retrieving Data from FIFO Self-Test Register Map Register Definitions Register 0x00—DEVID (Read Only) Register 0x1E, Register 0x1F, Register 0x20—OFSX, OFSY, OFSZ (Read/Write) Register 0x24—THRESH_ACT (Read/Write) Register 0x25—THRESH_INACT (Read/Write) Register 0x26—TIME_INACT (Read/Write) Register 0x27—ACT_INACT_CTL (Read/Write) ACT AC/DC and INACT AC/DC Bits ACT_x Enable Bits and INACT_x Enable Bits Register 0x2C—BW_RATE (Read/Write) LOW_POWER Bit Rate Bits Register 0x2D—POWER_CTL (Read/Write) Link Bit AUTO_SLEEP Bit Measure Bit Sleep Bit Wake-Up Bits Register 0x2E—INT_ENABLE (Read/Write) Register 0x2F—INT_MAP (Read/Write) Register 0x30—INT_SOURCE (Read Only) Register 0x31—DATA_FORMAT (Read/Write) SELF_TEST Bit SPI Bit INT_INVERT Bit FULL_RES Bit Justify Bit Range Bits Register 0x32 to Register 0x37—DATAX0, DATAX1, DATAY0, DATAY1, DATAZ0, DATAZ1 (Read Only) Register 0x38—FIFO_CTL (Read/Write) FIFO_MODE Bits Trigger Bit Samples Bits 0x39—FIFO_STATUS (Read Only) FIFO_TRIG Bit Entries Bits Applications Information Power Supply Decoupling Mechanical Considerations for Mounting Threshold Link Mode Sleep Mode vs. Low Power Mode Using Self-Test Data Formatting of Upper Data Rates Noise Performance Axes of Acceleration Sensitivity Solder Profile Outline Dimensions Ordering Guide Automotive Products