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Revision
2017-03-29
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PDF / 1.1 Mb
Dokumentensprache
Englisch
link. to. page. 5. link. to. page. 5. link. to. page. 5. link. to. page. 4. link. to. page. 4. link. to. page. 5. link. to. page. 5. link. to. page. 5. link. to. page. 5. link. to. page. 5. link. to
link to page 5 link to page 5 link to page 5 link to page 4 link to page 4 link to page 5 link to page 5 link to page 5 link to page 5 link to page 5 link to page 5 link to page 5 link to page 5 link to page 5 link to page 4 link to page 4 ISL32704E Absolute Maximum Ratings (Note 16) Thermal Information Supply Voltages (Note 6) Thermal Resistance (Typical) JA (°C/W) JC (°C/W) VDD1 to GND1 . -0.5V to +7V 16 Ld WB-SOIC Package (Notes 4, 5) . 60 12 VDD2 to GND2 . 7V 16 Ld QSOP Package (Notes 4, 5) . 60 10 Input Voltages, D, DE, RE. -0.5V to (VDD1 +0.5V) Maximum Junction Temperature (Plastic Package) . .-55°C to +150°C Input/Output Voltages Maximum Storage Temperature Range . .-55°C to +150°C A, B . -8V to +12.5V Maximum Power Dissipation (WB-SOIC) . .800mW R . -0.5V to (VDD1 +1V) Maximum Power Dissipation (QSOP). .675mW Short-Circuit Duration, A, B . Continuous Solder Profile . Per JEDEC J-STD-020C, MSL1 ESD Rating . See “ESD PERFORMANCE” on page 5 Pb-Free Reflow Profile . see TB493 Recommended Operating Conditions Supply Voltages VDD1. 3.0V to 5.5V VDD2, VDD2X . 4.5V to 5.5V High-Level Digital Input Voltage, VIH VDD1 = 3.3V . 2.4V to VDD1 VDD1 = 5.0V . 3.0V to VDD1 Low-Level Digital Input Voltage, VIL . .0V to 0.8V Input Voltage at any Bus Terminal (separately or common-mode), VI, VIC . .-7V to 12V Differential Input Voltage (Note 7), VID . .-7V to 12V High-Level Output Current (Driver), IOH . 60mA High-Level Digital Output Current (Receiver), IOH. 8mA Low-Level Output Current (Driver), IOL . -60mA Low-Level Digital Output Current (Receiver), IOL . -8mA Junction Temperature, TJ . .-40°C to +100°C Ambient Operating Temperature, TA . .-40°C to +85°C Digital Input Signal Rise and Fall Times, tIR, tIF . DC Stable CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. JA is measured in free air with the component soldered to a double-sided board. 5. For JC, the “case temp” location is the center of the package top side. Electrical Specifications Test Conditions: TMIN to TMAX, VDD1 = VDD2 = 4.5V to 5.5V; unless otherwise stated (see (Note 6). PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT DC CHARACTERISTICS Driver Line Output Voltage (VA, VB) (Note 6) VO No load VDD2 V Driver Differential Output Voltage (Note 7) VOD1 No load VDD2 V Driver Differential Output Voltage (Note 7) VOD2 RL = 54Ω 1.5 2.3 VDD2 V Change in Magnitude of Differential Output Voltage (Note 12) VOD RL = 54Ω or 100Ω 0.01 0.2 V Driver Common-Mode Output Voltage VOC RL = 54Ω or 100Ω 3 V Change in Magnitude of Driver Common-Mode Output Voltage VOC RL = 54Ω or 100Ω 0.01 0.20 V (Note 12) Bus Input Current (A, B) (Notes 9, 13) IIN2 DE = 0V VIN = 12V 1 mA VIN = -7V -0.8 mA High-Level Input Current (D, DE, RE) IIH VI = 3.5V 10 µA Low-Level Input Current (D, DE, RE) IIL VI = 0.4V -10 µA Absolute Short-Circuit Output Current IOS DE = VDD1, -7V ≤ VA or VB ≤ 12V ±250 mA Supply Current IDD1 VDD1 = 5V 4 6 mA VDD1 = 3.3V 3 4 mA Positive-Going Input Threshold Voltage VTH+ -7V ≤ VCM ≤ 12V 200 mV Negative-Going Input Threshold Voltage VTH- -7V ≤ VCM ≤ 12V -200 mV FN8860 Rev.3.00 Page 4 of 13 Mar 29, 2017 Document Outline Related Literature Features Applications Ordering Information Pin Configurations Truth Table Truth Table Pin Descriptions Typical Operating Circuits Absolute Maximum Ratings (Note 16) Thermal Information Recommended Operating Conditions Electrical Specifications Insulation Specifications Magnetic Field Immunity (Note 16) Safety and Approvals VDE V 0884-11 (Certification Pending) UL 1577 Electromagnetic Compatibility Application Information RS-485 and Isolation Digital Isolator Principle GMR Resistor in Detail Low Emissions Low EMI Susceptibility Receiver (Rx) Features Driver (Tx) Features Built-In Driver Overload Protection Dynamic Power Consumption Power Supply Decoupling DC Correctness Data Rate, Cables, and Terminations Transient Protection Pinout Differences Between Packages Revision History About Intersil Package Outline Drawing M16.15B M16.3A