Datasheet ADXL1001, ADXL1002 (Analog Devices) - 4

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ADXL1001/ADXL1002 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. RECOMMENDED SOLDERING PROFILE Parameter Rating
Figure 2 and Table 4 provide details about the recommended Acceleration (Any Axis, Unpowered) 10,000 g soldering profile. Acceleration (Any Axis, Powered) 10,000 g
CRITICAL ZONE
Drop Test (Concrete Surface) 1.2 m
tP TL TO TP TP
V −0.3 V to +5.5 V
RAMP-UP
DD Output Short-Circuit Duration Indefinite
TL T tL
(Any Pin to Common)
URE SMAX
Temperature Range (Storage) −55°C to +150°C
RAT E TSMIN P M E
Stresses at or above those listed under Absolute Maximum
T tS RAMP-DOWN
Ratings may cause permanent damage to the product. This is a
PREHEAT
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
t25°C TO PEAK
002 section of this specification is not implied. Operation beyond
TIME
15431- the maximum operating conditions for extended periods may Figure 2. Recommended Soldering Profile affect product reliability.
Table 4. Recommended Soldering Profile THERMAL RESISTANCE Condition Profile Feature Sn63/Pb37 Pb-Free
Thermal performance is directly linked to printed circuit board Average Ramp Rate (T 3°C/sec (PCB) design and operating environment. Careful attention to L to TP) 3°C/sec maximum maximum PCB thermal design is required. Preheat θ Minimum Temperature (T JA is the natural convection junction to ambient thermal SMIN) 100°C 150°C resistance measured in a one cubic foot sealed enclosure. θ Maximum Temperature (T JC is SMAX) 150°C 200°C the junction to case thermal resistance. Time, TSMIN to TSMAX (tS) 60 sec to 60 sec to 120 sec 180 sec
Table 3. Package Characteristics
TSMAX to TL
Package Type θ θ Device Weight
Ramp-Up Rate 3°C/sec 3°C/sec
JA JC
maximum maximum CP-32-261 48°C/W 14.1°C/W <0.2 g Time Maintained Above 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal Liquidous (TL) test board with nine thermal vias. See JEDEC JESD51. Liquidous Temperature (TL) 183°C 217°C Time (tL) 60 sec to 60 sec to 150 sec 150 sec Peak Temperature (TP) 240°C + 260°C + 0°C/−5°C 0°C/−5°C Time Within 5°C of Actual Peak 10 sec to 20 sec to Temperature (tP) 30 sec 40 sec Ramp-Down Rate 6°C/sec 6°C/sec maximum maximum Time 25°C to Peak Temperature 6 min 8 min (t25°C) maximum maximum
ESD CAUTION
Rev. 0 | Page 4 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE RECOMMENDED SOLDERING PROFILE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION MECHANICAL DEVICE OPERATION OPERATING MODES Measurement Mode Standby BANDWIDTH APPLICATIONS INFORMATION APPLICATION CIRCUIT ON DEMAND SELF TEST RATIOMETRIC OUTPUT VOLTAGE INTERFACING ANALOG OUTPUT BELOW 10 kHz INTERFACING ANALOG OUTPUT BEYOND 10 kHz OVERRANGE MECHANICAL CONSIDERATIONS FOR MOUNTING LAYOUT AND DESIGN RECOMMENDATIONS OUTLINE DIMENSIONS ORDERING GUIDE