Datasheet MCP3422, MCP3423, MCP3424 (Microchip) - 6

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MCP3422/3/4 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications:
Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, VDD = +5.0V, VSS = 0V, CHn+ = CHn- = VREF/2, VINCOM = VREF /2. All ppm units use 2*VREF as differential full scale range.
Parameters Sym Min Typ Max Units Conditions
PGA Gain Error Match
(Note 6)
— 0.1 — % Between any 2 PGA settings Gain Error Drift (
Note 6
) — 15 — ppm/°C PGA=1, DR=3.75 SPS Offset Error VOS — 15 55 µV Tested at PGA = 1 DR = 3.75 SPS Offset Drift vs. Temperature — 50 — nV/°C Common-Mode Rejection — 105 — dB at DC and PGA =1, — 110 — dB at DC and PGA =8, TA = +25°C Gain vs. VDD — 5 — ppm/V TA = +25°C, VDD = 2.7V to 5.5V, PGA = 1 Power Supply Rejection at DC — 100 — dB TA = +25°C, VDD = 2.7V to 5.5V, Input PGA = 1
Power Requirements
Voltage Range VDD 2.7 — 5.5 V Supply Current during IDDA — 145 180 µA VDD = 5.0V Conversion — 135 — µA VDD = 3.0V Supply Current during Standby IDDS — 0.3 1 µA VDD = 5.0V Mode
I2C Digital Inputs and Digital Outputs
High level input voltage VIH 0.7VDD — VDD V at SDA and SCL pins Low level input voltage VIL — — 0.3VDD V at SDA and SCL pins Low level output voltage VOL — — 0.4 V IOL = 3 mA Hysteresis of Schmidt Trigger VHYST 0.05VDD — — V fSCL = 100 kHz for inputs
(Note 7 )
Supply Current when I2C bus IDDB — — 10 µA Device is in standby mode while line is active I2C bus is active Input Leakage Current IILH — — 1 µA VIH = 5.5V IILL -1 — — µA VIL = GND
Logic Status of I2C Address Pins (Note 8)
Adr0 and Adr1 Pins Addr_Low VSS — 0.2VDD V The device reads logic low. Adr0 and Adr1 Pins Addr_High 0.75VDD — VDD V The device reads logic high. Adr0 and Adr1 Pins Addr_Float 0.35VDD — 0.6VDD V Read pin voltage if voltage is applied to the address pin.
(Note 9)
— VDD/2 — Device outputs float output voltage (VDD/2) on the address pin, if left “floating”.
(Note 10) Pin Capacitance and I2C Bus Capacitance
Pin capacitance CPIN — 4 10 pF I2C Bus Capacitance Cb — — 400 pF
Note 1:
Any input voltage below or greater than this voltage causes leakage current through the ESD diodes at the input pins. This parameter is ensured by characterization and not 100% tested.
2:
This input impedance is due to 3.2 pF internal input sampling capacitor.
3:
This parameter is ensured by design and not 100% tested.
4:
The total conversion speed includes auto-calibration of offset and gain.
5:
INL is the difference between the endpoints line and the measured code at the center of the quantization band.
6:
Includes all errors from on-board PGA and VREF.
7:
This parameter is ensured by characterization and not 100% tested.
8:
MCP3423 and MCP3424 only.
9:
Addr_Float voltage is applied at address pin.
10:
No voltage is applied at address pin (left “floating”). DS22088C-page 6 © 2009 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: INL vs. Supply Voltage (VDD). FIGURE 2-2: INL vs. Temperature. FIGURE 2-3: Offset Error vs. Temperature. FIGURE 2-4: Output Noise vs. Input Voltage. FIGURE 2-5: Total Error vs. Input Voltage. FIGURE 2-6: Gain Error vs. Temperature. FIGURE 2-7: IDDA vs. Temperature. FIGURE 2-8: IDDS vs. Temperature. FIGURE 2-9: IDDB vs. Temperature. FIGURE 2-10: Oscillator Drift vs. Temperature. FIGURE 2-11: Frequency Response. 3.0 Pin Descriptions TABLE 3-1: PIN Function Table 3.1 Analog Inputs (CHn+, CHn-) 3.2 Supply Voltage (VDD, VSS) FIGURE 3-1: Equivalent Analog Input Circuit. 3.3 Serial Clock Pin (SCL) 3.4 Serial Data Pin (SDA) 3.5 Exposed Thermal Pad (EP) 4.0 Description of Device Operation 4.1 General Overview 4.2 Power-On-Reset (POR) FIGURE 4-1: POR Operation. 4.3 Internal Voltage Reference 4.4 Analog Input Channels 4.5 Input Voltage Range 4.6 Input Impedance 4.7 Aliasing and Anti-aliasing Filter 4.8 Self-Calibration 4.9 Digital Output Codes and Conversion to Real Values TABLE 4-1: Resolution Settings VS. LSB TABLE 4-2: Example of output code for 18 bits (Note 1, Note 2) TABLE 4-3: Minimum and Maximum Output codes (Note) TABLE 4-4: Example of converting output code to voltage (With 18 Bit Setting) 5.0 Using the Devices 5.1 Operating Modes 5.2 Configuration Register TABLE 5-1: Write Configuration Bits TABLE 5-2: READ Configuration Bits 5.3 I2C Serial Communications FIGURE 5-1: Address Byte. FIGURE 5-2: General Call Latch Command and Voltage Output at Address Pin Left “Floating” (MCP3423 and MCP3424). FIGURE 5-3: Timing Diagram For Writing To The MCP3422/3/4. TABLE 5-3: Output Codes of each Resolution OPTION FIGURE 5-4: Timing Diagram For Reading From The MCP3422/3/4 With 18-Bit Mode. FIGURE 5-5: Timing Diagram For Reading From The MCP3422/3/4 With 12-Bit to 16-Bit Modes. 5.4 General Call FIGURE 5-6: General Call Address Format. 5.5 High-Speed (HS) Mode 5.6 I2C Bus Characteristics FIGURE 5-7: Data Transfer Sequence on I2C Serial Bus. TABLE 5-4: I2c serial timing Specifications (Continued) FIGURE 5-8: I2C Bus Timing Data. 6.0 Basic Application Configuration 6.1 Connecting to the Application Circuits FIGURE 6-1: Typical Connection. FIGURE 6-2: Example of Multiple Device Connection on I2C Bus. FIGURE 6-3: I2C Bus Connection Test. FIGURE 6-4: Differential and Single- Ended Input Connections. 6.2 Application Examples FIGURE 6-5: Battery Voltage and Charging/Discharging Current Measurement. FIGURE 6-6: Four-Channel Thermocouple Applications. FIGURE 6-7: Example of Pressure and Temperature Measurement. 7.0 Development Tool Support 7.1 MCP3422/3/4 Evaluation Boards FIGURE 7-1: MCP3424 Evaluation Board. FIGURE 7-2: Setup for the MCP3424 Evaluation Board with PICkit™ Serial Analyzer. FIGURE 7-3: Example of PICkit™ Serial User Interface. 8.0 Packaging Information 8.1 Package Marking Information