HMC602* PRODUCT PAGE QUICK LINKS Last Content Update: 10/05/2017COMPARABLE PARTSDESIGN RESOURCES View a parametric search of comparable parts. • HMC602 Material Declaration • PCN-PDN Information EVALUATION KITS • Quality And Reliability • HMC602LP4 Evaluation Board • Symbols and Footprints DOCUMENTATIONDISCUSSIONSData Sheet View all HMC602 EngineerZone Discussions. • HMC602 Data Sheet SAMPLE AND BUYTOOLS AND SIMULATIONS Visit the product page to see pricing options. • HMC602LP4E S-Parameters TECHNICAL SUPPORTREFERENCE MATERIALS Submit a technical question or find your regional support Quality Documentation number. • Package/Assembly Qualification Test Report: LP4, LP4B, LP4C, LP4K (QTR: 2013-00487 REV: 04) DOCUMENT FEEDBACK • Package/Assembly Qualification Test Report: Plastic Submit feedback for this data sheet. Encapsulated QFN (QTR: 05006 REV: 02) • Semiconductor Qualification Test Report: BiCMOS-A (QTR: 2013-00235) This page is dynamically generated by Analog Devices, Inc., and inserted into this data sheet. A dynamic change to the content on this page will not trigger a change to either the revision number or the content of the product data sheet. This dynamic page may be frequently modified.