Datasheet HMC813 (Analog Devices) - 10

HMC813
v02.0913
SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA) WITH LIMITED RF OUTPUT, 1 - 26 GHz Mounting & Bonding Techniques for MMICs
The die should be attached directly to the ground plane with epoxy (see HMC gen- eral Handling, Mounting , Bonding Note). 0.279mm (0.011”) Thick MMIC 50 Ohm Microstrip transmission lines on 0.254mm (10 mil) thick alumina thin film Wire Bond IP substrates are recommended for bringing RF to and from the chip (Figure 1). 0.076mm H Microstrip substrates should be placed as close to the die as possible in order to (0.003”) minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 C mm (3 to 6 mils). -
Handling Precautions
RF Ground Plane RS Follow these precautions to avoid permanent damage. O
Storage:
All bare die are placed in either Waffle or Gel based ESD protective con- T tainers, and then sealed in an ESD protective bag for shipment. Once the sealed 0.254mm (0.010”) Thick Alumina C ESD protective bag has been opened, all die should be stored in a dry nitrogen Thin Film Substrate environment. Figure 1. TE
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt to clean E the chip using liquid cleaning systems.
Static Sensitivity:
Follow ESD precautions to protect against ESD strikes. HMC813 is a Class-1A ESD sensitive part. Observe D handling precautions. R
Transients:
Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. WE
General Handling:
The chip may be handled by a vacuum collet or with a sharp pair of tweezers. O P
Mounting
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. I F nf o or r p mati r o in cfe ur , d nish e e l d iv b e y r A y a nalo n g d t Devi o p ces i la s c bele o ieve rd d t e o rbs e : H acc iutrtatite e M and ic reli rao bl w e. a H v o e C wever o , nrp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Phoe n r O e: 7 n- 81-li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o it nle i . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
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Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 p o plic ra a tio pp n S s u @ p h por ittti : Pte ho.c n om e: 1-800-ANALOG-D