Datasheet HMC913 (Analog Devices) - 9
| Hersteller | Analog Devices |
| Beschreibung | SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz |
| Seiten / Seite | 9 / 9 — HMC913. SUCCESSIVE DETECTION LOG VIDEO. AMPLIFER (SDLVA), 0.6 - 20 GHz. … |
| Dateiformat / Größe | PDF / 625 Kb |
| Dokumentensprache | Englisch |
HMC913. SUCCESSIVE DETECTION LOG VIDEO. AMPLIFER (SDLVA), 0.6 - 20 GHz. Mounting & Bonding Techniques for MMICs
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HMC913
v04.0913
SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz Mounting & Bonding Techniques for MMICs
The die should be attached directly to the ground plane with epoxy (see HMC gen- eral Handling, Mounting , Bonding Note). 0.279mm (0.011”) Thick MMIC IP 50 Ohm Microstrip transmission lines on 0.254mm (10 mil) thick alumina thin film H substrates are recommended for bringing RF to and from the chip (Figure 1). Wire Bond 0.076mm C Microstrip substrates should be placed as close to the die as possible in order to (0.003”) - minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). As
Handling Precautions
RF Ground Plane LV Follow these precautions to avoid permanent damage.
Storage:
All bare die are placed in either Waffle or Gel based ESD protective con- SD tainers, and then sealed in an ESD protective bag for shipment. Once the sealed 0.254mm (0.010”) Thick Alumina ESD protective bag has been opened, all die should be stored in a dry nitrogen Thin Film Substrate environment. Figure 1.
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity:
Follow ESD precautions to protect against ESD strikes.
Transients:
Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up.
General Handling:
The chip may be handled by a vacuum collet or with a sharp pair of tweezers.
Mounting
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m
9
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 p o lica rti a o p n S p u s p @ po h rt itt : P ite ho . n c e om : 1-800-ANALOG-D
v04.0913
SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz Mounting & Bonding Techniques for MMICs
The die should be attached directly to the ground plane with epoxy (see HMC gen- eral Handling, Mounting , Bonding Note). 0.279mm (0.011”) Thick MMIC IP 50 Ohm Microstrip transmission lines on 0.254mm (10 mil) thick alumina thin film H substrates are recommended for bringing RF to and from the chip (Figure 1). Wire Bond 0.076mm C Microstrip substrates should be placed as close to the die as possible in order to (0.003”) - minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). As
Handling Precautions
RF Ground Plane LV Follow these precautions to avoid permanent damage.
Storage:
All bare die are placed in either Waffle or Gel based ESD protective con- SD tainers, and then sealed in an ESD protective bag for shipment. Once the sealed 0.254mm (0.010”) Thick Alumina ESD protective bag has been opened, all die should be stored in a dry nitrogen Thin Film Substrate environment. Figure 1.
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity:
Follow ESD precautions to protect against ESD strikes.
Transients:
Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up.
General Handling:
The chip may be handled by a vacuum collet or with a sharp pair of tweezers.
Mounting
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m
9
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 p o lica rti a o p n S p u s p @ po h rt itt : P ite ho . n c e om : 1-800-ANALOG-D