Datasheet ADL5904 (Analog Devices) - 8

ADL5904 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage, V (PCB) design and operating environment. Careful attention to POS 5.5 V Input Average RF Power1 25 dBm PCB thermal design is required. Equivalent Voltage, Sine Wave Input 5.62 V peak
Table 3. Thermal Resistance
Maximum Junction Temperature 150°C
Package Type θ 1 2 JA θJC Unit
Operating Temperature Range −40°C to +105°C CP-16-22 80.05 4.4 °C/W Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C 1 Thermal impedance simulated value is based on no airflow with the exposed pad soldered to a 4-layer JEDEC board. 1 1 Driven from a 50 Ω source. Input ac-coupled with an external 82.5 Ω shunt Thermal impedance from junction to exposed pad on underside of package. resistor.
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 8 of 27 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS THEORY OF OPERATION BASIC CONNECTIONS FOR RMS MEASUREMENT CHOOSING A VALUE FOR CRMS VRMS CALIBRATION AND ERROR CALCULATION BASIC CONNECTIONS FOR THRESHOLD DETECTION Q AND QB RESPONSE TIME SETTING THE VIN− THRESHOLD DETECTION VOLTAGE APPLICATIONS INFORMATION EVALUATION BOARD SCHEMATIC AND CONFIGURATION OPTIONS OUTLINE DIMENSIONS ORDERING GUIDE