Datasheet ADL5910 (Analog Devices) - 7

Data Sheet ADL5910 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage, VPOS 5.5 V (PCB) design and operating environment. Careful attention to Input Average RF Power1 25 dBm PCB thermal design is required. Equivalent Voltage, Sine Wave Input 5.62 V peak
Table 3. Thermal Resistance
Maximum Junction Temperature 150°C
Package Type θ 1 2 JA θJC Unit
Operating Temperature Range −40°C to +105°C CP-16-22 80.05 4.4 °C/W Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C 1 Thermal impedance simulated value is based on no airflow with the exposed pad soldered to a 4-layer JEDEC board. 2 1 Drive this parameter from a 50 Ω source. It is input ac-coupled with an Thermal impedance from junction to exposed pad on underside of package. external 82.5 Ω shunt resistor, and VPOS = 3.3 V. Stresses at or above those listed under Absolute Maximum
ESD CAUTION
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 7 of 22 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BASIC CONNECTIONS Q AND QB RESPONSE TIME SETTING THE VIN− THRESHOLD DETECTION VOLTAGE APPLICATIONS INFORMATION A COMPLETE INPUT PROTECTION CIRCUIT RESET ON ENABLE OR AT POWER-UP IMPROVING FREQUENCY FLATNESS EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE