Datasheet ADL5566 (Analog Devices) - 7

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ADL5566 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
Table 3 lists the junction-to-air thermal resistance (θJA) and the Output Voltage Swing × Bandwidth Product 2300 V p-p MHz junction-to-paddle thermal resistance (θJC) for the ADL5566. Supply Voltage, VCC 5.25 V
Table 3. Thermal Resistance
VIPx, VINx VCC + 0.5 V
Package Type θ 1 2 JA θJC Unit
±IOUT Maximum ±30 mA 24-Lead LFCSP 34.0 1.8 °C/W Internal Power Dissipation 900 mW Maximum Junction Temperature 135°C 1 Measured on Analog Devices evaluation board. For more information about board layout, see the Pattern section. Operating Temperature Range −40°C to +105°C 2 Based on simulation with JEDEC standard JESD51. Storage Temperature Range −65°C to +150°C
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 6 of 24 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Circuit Description Applications Information Basic Connections Input and Output Interfacing Single-Ended Input to Differential Output Gain Adjustment and Interfacing ADC Interfacing DC-Coupled Receiver Application Layout Considerations Soldering Information and Recommended Land Pattern Evaluation Board Outline Dimensions Ordering Guide