Datasheet ADL5205 (Analog Devices) - 7

link to page 7 link to page 7 link to page 4
ADL5205 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
Table 4 shows the thermal resistance from the die to ambient Differential Output Voltage Swing × 3 V-GHz (θJA), die to board (θJB), and die to lead (θJC), respectively. Bandwidth Product
Table 4. Thermal Resistance
Supply Voltage, VPOS 5.4 V
Package Type θ
PWUPA, PWUPB, A0 to A5, B0 to B5, MODE0, −0.5 V to +3.6 V
JA θJB θJC Unit
MODE1, PM, LATCH A, LATCH B 40-Lead LFCSP 47.7 24.4 15.4 °C/W Input Voltage (VINx+ ,VINx−) −0.5 V to +3.1 V
JUNCTION TO BOARD THERMAL IMPEDANCE
Differential Input Voltage ((VINx+) − (VINx−)) ±1 V Internal Power Dissipation 1000 mW The junction to board thermal impedance (θJB) is the thermal Maximum Junction Temperature 135°C impedance from the die to the leads of the ADL5205. The value given in Table 4 is based on the standard printed circuit board Operating Temperature Range −40°C to +85°C (PCB) described in the JESD51-7 standard for thermal testing Storage Temperature Range −65°C to +150°C of surface-mount components. PCB size and complexity (number Stresses at or above those listed under Absolute Maximum of layers) affect θJB; more layers tend to reduce thermal impedance Ratings may cause permanent damage to the product. This is a slightly. stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational If the PCB temperature is known, use the junction to board section of this specification is not implied. Operation beyond thermal impedance to calculate the die temperature (also the maximum operating conditions for extended periods may known as the junction temperature) to ensure that the die affect product reliability. temperature does not exceed the specified limit of 135°C. For example, if the PCB temperature is 85°C, the die temperature is given by TJ = TB + (PDISS × θJB) The worst case power dissipation for the ADL5205 is 919 mW (5.25 V × 175 mA, see Table 1). Therefore, TJ is TJ = 85°C + (0.919 W × 24.4°C/W) = 107.4°C
ESD CAUTION
Rev. 0 | Page 6 of 31 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS Timing Diagrams ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE JUNCTION TO BOARD THERMAL IMPEDANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BASIC STRUCTURE CONTROL/LOGIC CIRCUITRY COMMON-MODE VOLTAGE APPLICATIONS INFORMATION BASIC CONNECTIONS DIGITAL INTERFACE OVERVIEW Parallel Digital Interface Serial Peripheral Interface (SPI) Up/Down Interface SPI READ ADC INTERFACING NOISE FIGURE vs. GAIN SETTING EVALUATION BOARD OVERVIEW POWER SUPPLY INTERFACE SIGNAL INPUTS AND OUTPUTS MANUAL CONTROLS Mode Switches Channel Control Switches PARALLEL INTERFACE SERIAL INTERFACE STANDARD DEVELOPMENT PLATFORM (SDP) INTERFACE EVALUATION BOARD CONTROL SOFTWARE COMMAND LINE CONTROL PROGRAM GRAPHICAL USER INTERFACE (GUI) PROGRAM EVALUATION BOARD SCHEMATICS AND LAYOUT BILL OF MATERIALS OUTLINE DIMENSIONS ORDERING GUIDE