Datasheet AD5383 (Analog Devices) - 9

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AD5383 Data Sheet Parameter AD5383-31 Unit Test Conditions/Comments
LOGIC OUTPUTS (BUSY, SDO)3 VOL, Output Low Voltage 0.4 V max Sinking 200 µA VOH, Output High Voltage DVDD – 0.5 V min Sourcing 200 µA High Impedance Leakage Current ±1 µA max SDO only High Impedance Output Capacitance 5 pF typ SDO only LOGIC OUTPUT (SDA)3 VOL, Output Low Voltage 0.4 V max ISINK = 3 mA 0.6 V max ISINK = 6 mA Three-State Leakage Current ±1 µA max Three-State Output Capacitance 8 pF typ POWER REQUIREMENTS AVDD 2.7/3.6 V min/max DVDD 2.7/5.5 V min/max Power Supply Sensitivity3 ΔMidscale/ΔΑVDD –85 dB typ AIDD 0.375 mA/channel max Outputs unloaded, boost off; 0.25 mA/channel typ 0.475 mA/channel max Outputs unloaded, boost on; 0.325 mA/channel typ DIDD 1 mA max VIH = DVDD, VIL = DGND. AIDD (Power-Down) 20 µA max Typically 200 nA DIDD (Power-Down) 20 µA max Typically 1 µA Power Dissipation 39 mW max Outputs unloaded, boost off; AVDD = DVDD = 3 V 1 AD5383-3 is calibrated using an external 1.25 V reference. Temperature range is –40°C to +85°C. 2 Accuracy guaranteed from VOUT = 10 mV to AVDD – 50 mV. 3 Guaranteed by characterization, not production tested. 4 Default on the AD5383-3 is 1.25 V. Programmable to 2.5 V via CR10 in the AD5383 control register; operating the AD5383-3 with a 2.5 V reference leads to degraded accuracy specifications and limited input code range.
AC CHARACTERISTICS1
AVDD = 4.5 V to 5.5 V or 2.7 V to 3.6 V; DVDD = 2.7 V to 5.5 V; AGND = DGND = 0 V.
Table 3. Parameter All Unit Test Conditions/Comments
DYNAMIC PERFORMANCE Output Voltage Settling Time2 ¼ scale to ¾ scale change settling to ±1 LSB 3 µs typ Boost mode off, CR9 = 0 8 µs max Boost mode off, CR9 = 0 Slew Rate2 1.5 V/µs typ Boost mode off, CR9 = 0 2.5 V/µs typ Boost mode on, CR9 = 1 Digital-to-Analog Glitch Energy 12 nV-s typ Glitch Impulse Peak Amplitude 15 mV typ DAC-to-DAC Crosstalk 1 nV-s typ See Terminology section Digital Crosstalk 0.8 nV-s typ Digital Feedthrough 0.1 nV-s typ Effect of input bus activity on DAC output under test Output Noise 0.1 Hz to 10 Hz 15 µV p-p typ External reference, midscale loaded to DAC 40 µV p-p typ Internal reference, midscale loaded to DAC Output Noise Spectral Density At 1 kHz 150 nV/√Hz typ At 10 kHz 100 nV/√Hz typ 1 Guaranteed by design and characterization, not production tested. 2 The slew rate can be programmed via the current boost control bit (CR9) in the AD5383 control register. Rev. D | Page 8 of 40 Document Outline Features Integrated Functions Applications Functional Block Diagram Table of Contents Revision History General Description Specifications AD5383-5 Specifications AD5383-3 Specifications AC Characteristics9F Timing Characteristics Serial Interface Timing I2C Serial Interface Timing Parallel Interface Timing Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Terminology Typical Performance Characteristics Functional Description DAC Architecture—General Data Decoding On-Chip Special Function Registers (SFR) SFR Commands NOP (No Operation) Write CLR Code Soft CLR Soft Power-Down Soft Power-Up Soft RESET Control Register Write/Read Channel Monitor Function Hardware Functions Reset Function Asynchronous Clear Function BUSY\ and LDAC\ Functions FIFO Operation in Parallel Mode Power-On Reset Power-Down Interfaces DSP-, SPI-, MICROWIRE-Compatible Serial Interfaces Standalone Mode Daisy-Chain Mode Readback Mode I2C Serial Interface I2C Data Transfer START and STOP Conditions Repeated START Conditions Acknowledge Bit (ACK) AD5383 Slave Addresses Write Operation 4-Byte Mode 3-Byte Mode 2-Byte Mode Parallel Interface CS\ Pin WR\ Pin REG0, REG1 Pins Pins A4 to A0 Pins DB11 to DB0 Microprocessor Interfacing Parallel Interface AD5383 to MC68HC11 AD5383 to PIC16C6x/7x AD5383 to 8051 AD5383 to ADSP-BF527 Applications Information Power Supply Decoupling Power Supply Sequencing Typical Configuration Circuit Channel Monitor Function Toggle Mode Function Thermal Monitor Function Optical Attenuators Utilizing the FIFO Outline Dimensions Ordering Guide