Datasheet AD7811, AD7812 (Analog Devices) - 4

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AD7811/AD7812 ABSOLUTE MAXIMUM RATINGS*
SOIC Package, Power Dissipation . 450 mW V to DGND . –0.3 V to +7 V DD θJA Thermal Impedance . 75°C/W Digital Input Voltage to DGND (CONVST, SCLK, RFS, TFS, Lead Temperature, Soldering DIN, A0) . –0.3 V, VDD + 0.3 V Vapor Phase (60 sec) . 215°C Digital Output Voltage to DGND (DOUT) Infrared (15 sec) . 220°C . –0.3 V, VDD + 0.3 V TSSOP Package, Power Dissipation . 450 mW REFIN to AGND . –0.3 V, VDD + 0.3 V θJA Thermal Impedance . 115°C/W Analog Inputs Lead Temperature, Soldering VIN1–VIN4 (AD7811) . –0.3 V, VDD + 0.3 V Vapor Phase (60 sec) . 215°C VIN1–VIN8 (AD7812) . –0.3 V, VDD + 0.3 V Infrared (15 sec) . 220°C Storage Temperature Range . –65°C to +150°C *Stresses above those listed under Absolute Maximum Ratings may cause perma- Junction Temperature . 150°C nent damage to the device. This is a stress rating only; functional operation of the Plastic DIP Package, Power Dissipation . 450 mW device at these or any other conditions above those listed in the operational θ sections of this specification is not implied. Exposure to absolute maximum rating JA Thermal Impedance . 105°C/W Lead Temperature, (Soldering 10 sec) . 260°C conditions for extended periods may affect device reliability.
ORDERING GUIDE Linearity Package Package Model
1
Error Descriptions Options
AD7811YNZ ±1 LSB 16-Lead Plastic DIP N-16 AD7811YRZ ±1 LSB 16-Lead Small Outline IC (SOIC) R-16A AD7811YRU ±1 LSB 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 AD7812YN ±1 LSB 20-Lead Plastic DIP N-20 AD7812YR ±1 LSB 20-Lead Small Outline IC (SOIC) R-20A AD7812YRU ±1 LSB 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although
WARNING!
the AD7811/AD7812 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
ESD SENSITIVE DEVICE
are recommended to avoid performance degradation or loss of functionality. –4– REV. B C Document Outline Features General Description Product Highlights Functional Block Diagram Specifications Timing Characteristics Absolute Maximum Ratings ESD Caution Pin Configurations Pin Function Descriptions Terminology Signal to (Noise + Distortion) Ratio Total Harmonic Distortion Peak Harmonic or Spurious Noise Intermodulation Distortion Channel-to-Channel Isolation Relative Accuracy Differential Nonlinearity Offset Error Offset Error Match Gain Error Gain Error Match Track/Hold Acquisition Time Control Register (AD7811) Control Register (AD7812) Circuit Description Converter Operation Typical Connection Diagram Analog Input DC Acquisition Time AC Acquisition Time On-Chip Reference ADC Transfer Function Power-Down Options Power-On-Reset Power-Up Times Mode 2 Full Power-Down (PD1 = 1, PD0 = 0) Mode 2 Partial Power-Down (PD1 = 0, PD0 = 1) Power vs. Throughput Operating Modes Mode 1 Operation (High Speed Sampling) Mode 2 Operation (Automatic Power-Down) Serial Interface Simplifying the Serial Interface Microprocessor Interfacing AD7811/AD7812 to PIC16C6x/7x AD7811/AD7812 to MC68HC11 AD7811/AD7812 to 8051