Datasheet AD7492 (Analog Devices) - 8
| Hersteller | Analog Devices |
| Beschreibung | 1MSPS, 4mW Internal Ref & Clk, 12-Bit Parallel ADC |
| Seiten / Seite | 25 / 8 — AD7492. ABSOLUTE MAXIMUM RATINGS. Table 4. Parameter Ratings. ESD CAUTION |
| Revision | A |
| Dateiformat / Größe | PDF / 377 Kb |
| Dokumentensprache | Englisch |
AD7492. ABSOLUTE MAXIMUM RATINGS. Table 4. Parameter Ratings. ESD CAUTION
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AD7492 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Stresses above those listed under Absolute Maximum Ratings
Table 4.
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
Parameter Ratings
other conditions above those indicated in the operational AVDD to AGND/DGND −0.3 V to +7 V section of this specification is not implied. Exposure to absolute DVDD to AGND/DGND −0.3 V to +7 V maximum rating conditions for extended periods may affect VDRIVE to AGND/DGND −0.3 V to +7 V device reliability. AVDD to DVDD −0.3 V to +0.3 V VDRIVE to DVDD −0.3 V to DVDD + 0.3 V AGND to DGND −0.3 V to +0.3 V Analog Input Voltage to AGND −0.3 V to AVDD + 0.3 V Digital Input Voltage to DGND −0.3 V to DVDD + 0.3 V Input Current to Any Pin Except ±10 mA Supplies1 Operating Temperature Range Commercial (A and B Versions) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C SOIC, TSSOP Package Dissipation 450 mW θJA Thermal Impedance 75°C/W (SOIC) 115°C/W (TSSOP) θJC Thermal Impedance 25°C/W (SOIC) 35°C/W (TSSOP) Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 Transient currents of up to 100 mA do not cause SCR latch-up.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. A | Page 7 of 24 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AD7492-5 AD7492/AD7492-4 TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PEFORMANCE CHARACTERISTICS TERMINOLOGY CIRCUIT DESCRIPTION CONVERTER OPERATION TYPICAL CONNECTION DIAGRAM ADC TRANSFER FUNCTION AC ACQUISITION TIME DC ACQUISITION TIME ANALOG INPUT PARALLEL INTERFACE OPERATING MODES POWER-UP GROUNDING AND LAYOUT POWER SUPPLIES MICROPROCESSOR INTERFACING OUTLINE DIMENSIONS ORDERING GUIDE
AD7492 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Stresses above those listed under Absolute Maximum Ratings
Table 4.
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
Parameter Ratings
other conditions above those indicated in the operational AVDD to AGND/DGND −0.3 V to +7 V section of this specification is not implied. Exposure to absolute DVDD to AGND/DGND −0.3 V to +7 V maximum rating conditions for extended periods may affect VDRIVE to AGND/DGND −0.3 V to +7 V device reliability. AVDD to DVDD −0.3 V to +0.3 V VDRIVE to DVDD −0.3 V to DVDD + 0.3 V AGND to DGND −0.3 V to +0.3 V Analog Input Voltage to AGND −0.3 V to AVDD + 0.3 V Digital Input Voltage to DGND −0.3 V to DVDD + 0.3 V Input Current to Any Pin Except ±10 mA Supplies1 Operating Temperature Range Commercial (A and B Versions) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C SOIC, TSSOP Package Dissipation 450 mW θJA Thermal Impedance 75°C/W (SOIC) 115°C/W (TSSOP) θJC Thermal Impedance 25°C/W (SOIC) 35°C/W (TSSOP) Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 Transient currents of up to 100 mA do not cause SCR latch-up.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. A | Page 7 of 24 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AD7492-5 AD7492/AD7492-4 TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PEFORMANCE CHARACTERISTICS TERMINOLOGY CIRCUIT DESCRIPTION CONVERTER OPERATION TYPICAL CONNECTION DIAGRAM ADC TRANSFER FUNCTION AC ACQUISITION TIME DC ACQUISITION TIME ANALOG INPUT PARALLEL INTERFACE OPERATING MODES POWER-UP GROUNDING AND LAYOUT POWER SUPPLIES MICROPROCESSOR INTERFACING OUTLINE DIMENSIONS ORDERING GUIDE