Datasheet LT3959 (Analog Devices) - 2
Hersteller | Analog Devices |
Beschreibung | Wide Input Voltage Range Boost/SEPIC/Inverting Converter with 6A, 40V Switch |
Seiten / Seite | 26 / 2 — absoluTe MaxiMuM raTings (Note 1). pin conFiguraTion |
Dateiformat / Größe | PDF / 341 Kb |
Dokumentensprache | Englisch |
absoluTe MaxiMuM raTings (Note 1). pin conFiguraTion
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Textversion des Dokuments
LT3959
absoluTe MaxiMuM raTings (Note 1)
VIN ..40V VC, SS ...3V EN/UVLO (Note 2) ...40V RT ..1.5V DRIVE ...40V GND, GNDK to SGND ...±0.3V PGOOD ..40V FBX ... –3V to 3V SW ..40V Operating Junction Temperature Range (Note 3) INTVCC ..8V LT3959E/LT3959I .. –40°C to 125°C SYNC ..8V Storage Temperature Range .. –65°C to 125°C
pin conFiguraTion
TOP VIEW TOP VIEW CC NC 1 38 NC INTV PGOOD SYNC RT SS FBX V C NC 2 37 NC 36 35 34 33 32 31 30 NC 3 36 NC NC 1 28 DRIVE V 4 35 NC C NC 2 27 VIN FBX 5 34 EN/UVLO NC 3 37 SGND SS 6 33 VIN SGND 4 25 EN/UVLO RT 7 32 DRIVE 24 SGND 39 SYNC 8 31 INTV NC 6 23 NC SGND CC PGOOD 9 30 NC SGND 10 29 SGND SW 8 38 21 SW SW SW 9 20 SW NC 11 28 NC NC 10 SW 12 27 SW 40 12 13 14 15 16 17 NC 13 26 NC SW NC 14 25 NC GNDK GND GND GND GND GND SW 15 24 SW NC 16 23 NC UHEMA PACKAGE 36-LEAD (5mm × 6mm) PLASTIC QFN GNDK 17 22 GND TJMAX =125°C, θJA = 42°C/W, θJC = 3°C/W GND 18 21 GND EXPOSED PAD (PIN 37) IS SGND, MUST BE SOLDERED TO SGND PLANE EXPOSED PAD (PIN 38) IS SW, MUST BE SOLDERED TO SW PLANE GND 19 20 GND FE PACKAGE 38-LEAD PLASTIC TSSOP TJMAX =125°C, θJA = 42°C/W, θJC = 3°C/W EXPOSED PAD (PIN 39) IS SGND, MUST BE SOLDERED TO SGND PLANE EXPOSED PAD (PIN 40) IS SW, MUST BE SOLDERED TO SW PLANE 3959fa 2 For more information www.linear.com/LT3959 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Applications Information Typical Applications Package Description Revision History Related Parts