Datasheet AD815 (Analog Devices) - 4

AD815 ABSOLUTE MAXIMUM RATINGS1 MAXIMUM POWER DISSIPATION
Supply Voltage . ± 18 V Total The maximum power that can be safely dissipated by the AD815 Internal Power Dissipation2 is limited by the associated rise in junction temperature. The Small Outline (RB) . 2.4 Watts (Observe Derating Curves) maximum safe junction temperature for the plastic encapsulated Input Voltage (Common Mode) . ± VS parts is determined by the glass transition temperature of the Differential Input Voltage . ± 6 V plastic, about 150°C. Exceeding this limit temporarily may Output Short Circuit Duration cause a shift in parametric performance due to a change in the . Observe Power Derating Curves stresses exerted on the die by the package. Exceeding a junction Can Only Short to Ground temperature of 175°C for an extended period can result in Storage Temperature Range device failure. RB Package . –65°C to +125°C The AD815 has thermal shutdown protection, which guarantees Operating Temperature Range that the maximum junction temperature of the die remains below a AD815A . –40°C to +85°C safe level, even when the output is shorted to ground. Shorting Lead Temperature Range (Soldering, 10 sec) . 300°C the output to either power supply will result in device failure. NOTES To ensure proper operation, it is important to observe the 1Stresses above those listed under Absolute Maximum Ratings may cause perma- derating curves and refer to the section on power considerations. nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational It must also be noted that in high (noninverting) gain configurations section of this specification is not implied. Exposure to absolute maximum rating (with low values of gain resistor), a high level of input overdrive conditions for extended periods may affect device reliability. 2 can result in a large input error current, which may result in a Specification is for device in free air with 0 ft/min air flow: 24-Lead Surface Mount: significant power dissipation in the input stage. This power θJA = 52°C/W. must be included when computing the junction temperature rise
PIN CONFIGURATION
due to total internal power.
24-Lead Thermally-Enhanced SOIC (RB-24) 14 TJ = 150
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C 13 NC 1 24 NC 12 NC 2 23 NC 11 NC 3 22 NC 10 NC 4 21 9 NC 8 5 20 AD815 THERMAL 7 THERMAL 6 TOP VIEW 19 HEAT TABS HEAT TABS 6 (Not to Scale) 7 18 +V +V S* S* 5 8 17 4 +IN1 9 16 +IN2 3 –IN1 10 15 –IN2
θ
2 JA = 52
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C/W MAXIMUM POWER DISSIPATION – Watts (STILL AIR = 0 FT/MIN) OUT1 11 14 OUT2 1 AD815ARB-24 NO HEAT SINK –V 12 13 +V 0 S S –50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 NC = NO CONNECT AMBIENT TEMPERATURE –
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C *HEAT TABS ARE CONNECTED TO THE POSITIVE SUPPLY.
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD815 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
ESD SENSITIVE DEVICE
precautions are recommended to avoid performance degradation or loss of functionality. REV. D –3– Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION MAXIMUM POWER DISSIPATION Typical Performance Characteristics THEORY OF OPERATION Choice of Feedback and Gain Resistors PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS POWER SUPPLY BYPASSING DC ERRORS AND NOISE POWER CONSIDERATIONS Other Power Considerations Parallel Operation Differential Operation Creating Differential Signals Direct Single-Ended-to-Differential Conversion Twelve Channel Video Distribution Amplifier OUTLINE DIMENSIONS Ordering Guide Revision History