Datasheet AD8021 (Analog Devices) - 9

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AD8021 ABSOLUTE MAXIMUM RATINGS Table 4. MAXIMUM POWER DISSIPATION Parameter Rating
The maximum power that can be safely dissipated by the Supply Voltage 26.4 V AD8021 is limited by the associated rise in junction tempera- Power Dissipation Observed power derating curves ture. The maximum safe junction temperature for plastic Input Voltage (Common Mode) ±V encapsulated devices is determined by the glass transition S ± 1 V Differential Input Voltage1 ±0.8 V temperature of the plastic, approximately 150°C. Temporarily Differential Input Current ±10 mA exceeding this limit can cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Output Short-Circuit Duration Observed power derating curves Exceeding a junction temperature of 175°C for an extended Storage Temperature Range −65°C to +125°C period can result in device failure. Operating Temperature Range −40°C to +85°C While the AD8021 is internally short-circuit protected, this can Lead Temperature (Soldering, 10 sec) 300°C not be sufficient to guarantee that the maximum junction tem- perature (150°C) is not exceeded under all conditions. To ensure 1 The AD8021 inputs are protected by diodes. Current-limiting resistors are not used to preserve the low noise. If a differential input exceeds ±0.8 V, the proper operation, it is necessary to observe the maximum input current should be limited to ±10 mA. power derating curves. Stresses above those listed under Absolute Maximum Ratings
2.0
may cause permanent damage to the device. This is a stress
)
rating only; functional operation of the device at these or any
W N (
other conditions above those indicated in the operational
1.5 IO
section of this specification is not implied. Exposure to absolute
AT 8-LEAD SOIC IP S
maximum rating conditions for extended periods may affect
S
device reliability.
R DI 1.0 E W O P 8-LEAD MSOP UM IM 0.5 X A M
04 0 8-
0.01
188 0
–55 –45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Temperature1 1 Specification is for device in free air: 8-lead SOIC: θJA = 125°C/W; 8-lead MSOP: θJA = 145°C/W.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. F | Page 7 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION CONNECTION DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS APPLICATIONS USING THE DISABLE FEATURE THEORY OF OPERATION PCB LAYOUT CONSIDERATIONS DRIVING 16-BIT ADCs DIFFERENTIAL DRIVER USING THE AD8021 IN ACTIVE FILTERS DRIVING CAPACITIVE LOADS OUTLINE DIMENSIONS ORDERING GUIDE