Datasheet ADA4857-1, ADA4857-2 (Analog Devices) - 6

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ADA4857-1/ADA4857-2 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3.
The power dissipated in the package (PD) is the sum of the
Parameter Rating
quiescent power dissipation and the power dissipated in the die due to the ADA4857 drive at the output. The quiescent Supply Voltage 11 V power is the voltage between the supply pins (V Power Dissipation See Figure 4 S) times the quiescent current (I Common-Mode Input Voltage −V S). S + 0.7 V to +VS − 0.7 V Differential Input Voltage ±VS PD = Quiescent Power + (Total Drive Power − Load Power) Exposed Paddle Voltage −VS  V V  V 2 Storage Temperature Range −65°C to +125°C P = (V × I ) S OUT OUT + × D S S –   Operating Temperature Range −40°C to +125°C  2 RL  RL Lead Temperature (Soldering, 10 sec) 300°C RMS output voltages must be considered. If RL is referenced Junction Temperature 150°C to −VS, as in single-supply operation, the total drive power is Stresses at or above those listed under Absolute Maximum VS × IOUT. If the rms signal levels are indeterminate, consider the Ratings may cause permanent damage to the product. This is a worst case, when VOUT = VS/4 for RL to midsupply. stress rating only; functional operation of the product at these 2 /4 P = (V × I ) (V ) S or any other conditions above those indicated in the operational + D S S R section of this specification is not implied. Operation beyond L the maximum operating conditions for extended periods may In single-supply operation with RL referenced to −VS, the worst affect product reliability. case is VOUT = VS/2.
THERMAL RESISTANCE
Airflow increases heat dissipation, effectively reducing θJA. In addition, more metal directly in contact with the package θJA is specified for the worst-case conditions, that is, θJA is specified leads and exposed paddle from metal traces, through holes, for device soldered in circuit board for surface-mount packages. ground, and power planes reduces θJA.
Table 4.
Figure 4 shows the maximum power dissipation in the package
Package Type θJA θJC Unit
vs. the ambient temperature for the SOIC and LFCSP packages 8-Lead SOIC 115 15 °C/W on a JEDEC standard 4-layer board. θJA values are approximations. 8-Lead LFCSP 94.5 34.8 °C/W
3.0
16-Lead LFCSP 68.2 19 °C/W
) 2.5 (W MAXIMUM POWER DISSIPATION N TIO
The maximum safe power dissipation for the ADA4857 is
2.0 PA
limited by the associated rise in junction temperature (T
ISSI ADA4857-2 (LFCSP)
J) on
D 1.5
the die. At approximately 150°C, which is the glass transition
ER W
temperature, the properties of the plastic change. Even temporarily
1.0
exceeding this temperature limit may change the stresses that
M PO MU ADA4857-1 (LFCSP)
the package exerts on the die, permanently shifting the parametric
XI 0.5
performance of the ADA4857. Exceeding a junction temperature of
MA ADA4857-1 (SOIC)
175°C for an extended period can result in changes in silicon
0
devices, potentially causing degradation or loss of functionality.
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110 120
004
AMBIENT TEMPERATURE (°C)
07040- Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
Rev. D | Page 6 of 21 Document Outline FEATURES APPLICATIONS CONNECTION DIAGRAMS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ±5 V SUPPLY +5 V SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS APPLICATIONS INFORMATION POWER-DOWN OPERATION CAPACITIVE LOAD CONSIDERATIONS RECOMMENDED VALUES FOR VARIOUS GAINS ACTIVE LOW-PASS FILTER (LPF) NOISE CIRCUIT CONSIDERATIONS PCB LAYOUT POWER SUPPLY BYPASSING GROUNDING OUTLINE DIMENSIONS ORDERING GUIDE