link to page 6 Data SheetADA4075-2ABSOLUTE MAXIMUM RATINGSTHERMAL RESISTANCETable 4. ParameterRating θJA is specified for the worst-case conditions, that is, a device Supply Voltage ±20 V soldered in a circuit board for surface-mount packages. This Input Voltage ±V was measured using a standard 4-layer board. SY Input Current1 ±10 mA Table 5. Thermal Resistance Differential Input Voltage ±1.2 V Package TypeθJAθJCUnit Output Short-Circuit Duration to GND Indefinite 8-Lead SOIC 158 43 °C/W Storage Temperature Range −65°C to +150°C 8-Lead LFCSP 115 40 °C/W Operating Temperature Range −40°C to +125°C Junction Temperature Range −65°C to +150°C POWER SEQUENCING Lead Temperature (Soldering, 60 sec) 300°C The op amp supplies must be established simultaneously with, 1 The input pins have clamp diodes to the power supply pins. or before, any input signals are applied. If this is not possible, Stresses above those listed under Absolute Maximum Ratings limit the input current to 10 mA. may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any ESD CAUTION other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. C | Page 5 of 24 Document Outline Features Applications Pin Configurations General Description Table of Contents Revision History Specifications Absolute Maximum Ratings Thermal Resistance Power Sequencing ESD Caution Typical Performance Characteristics Applications Information Input Protection Total Harmonic Distortion Phase Reversal DAC Output Filter Balanced Line Driver Balanced Line Receiver Low Noise Parametric Equalizer Schematic Outline Dimensions Ordering Guide