Datasheet MCP631, MCP632, MCP633, MCP634, MCP635, MCP639 (Microchip) - 10

MCP631/2/3/4/5/9 Note:
Unless otherwise indicated, TA = +25°C, VDD = +2.5V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 2 kto VL, CL = 50 pF and CS = VSS.
2.2 Other DC Voltages and Currents 1000 3.5 om
V
3.0 ro
DD = 5.5V
t r) 2.5 100 Head rren lifie e u 2.0 p C
+125°C
m ltag (mV)
VDD = 2.5V V +85°C OL – VSS
ly /a 1.5 o p
+25°C
10 t V (mA 1.0
-40°C
u Sup tp u 0.5 O
VDD – VOH
1 0.0 0 5 0 5 0 5 0 5 0 5 0 5 0 5 0.1 1 10 100 0. 0. 1. 1. 2. 2. 3. 3. 4. 4. 5. 5. 6. 6. Output Current Magnitude (mA) Power Supply Voltage (V) FIGURE 2-16:
Output Voltage Headroom
FIGURE 2-19:
Supply Current vs. Power vs. Output Current. Supply Voltage.
20 3.5
R
18
L = 2 kΩ
3.0 16
VDD = 5.5V
(mV) t 14 r) 2.5 m ie o 12 rren lif ro
V
u 2.0
OL – VSS
p d 10
V V DD = 5.5V
C
DD = 2.5V
ly /am 1.5 8 A t Hea u 6 upp (m 1.0 S tp u 4 0.5 O 2
VDD = 2.5V VDD – VOH
0 0.0 0 5 0 5 0 5 0 5 0 5 0 5 0 -50 -25 0 25 50 75 100 125 -0.5 0. 0. 1. 1. 2. 2. 3. 3. 4. 4. 5. 5. 6. Ambient Temperature (°C) Common Mode Input Voltage (V) FIGURE 2-17:
Output Voltage Headroom
FIGURE 2-20:
Supply Current vs. vs. Ambient Temperature. Common-Mode Input Voltage.
100 t 80 rren 60
+125°C
40 it Cu
+85°C
cu 20
+25°C
A)
-40°C
0 rt Cir (m -20 o h -40 t S u -60 tp u -80 O -100 0 5 0 5 0 5 0 5 0 5 0 5 0 5 0. 0. 1. 1. 2. 2. 3. 3. 4. 4. 5. 5. 6. 6. Power Supply Voltage (V) FIGURE 2-18:
Output Short-Circuit Current vs. Power Supply Voltage. DS20002197C-page 10  2009-2014 Microchip Technology Inc. Document Outline 24 MHz, 2.5 mA Rail-to-Rail Output (RRO) Op Amps Features: Typical Applications: Design Aids: Description: Typical Application Circuit High Gain-Bandwidth Op Amp Portfolio Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications DC Electrial Specifications AC Electrical Specifications Digital Electrical Specifications Temperature Specifications 1.3 Timing Diagram FIGURE 1-1: Timing Diagram. 1.4 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves 2.1 DC Signal Inputs FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Power Supply Voltage with VCM = 0V. FIGURE 2-4: Input Offset Voltage vs. Output Voltage. FIGURE 2-5: Low-Input Common-Mode Voltage Headroom vs. Ambient Temperature. FIGURE 2-6: High-Input Common-Mode Voltage Headroom vs. Ambient Temperature. FIGURE 2-7: Input Offset Voltage vs. Common-Mode Voltage with VDD = 2.5V. FIGURE 2-8: Input Offset Voltage vs. Common-Mode Voltage with VDD = 5.5V. FIGURE 2-9: CMRR and PSRR vs. Ambient Temperature. FIGURE 2-10: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-11: DC Open-Loop Gain vs. Load Resistance. FIGURE 2-12: Input Bias and Offset Currents vs. Ambient Temperature with VDD = 5.5V. FIGURE 2-13: Input Bias Current vs. Input Voltage (below VSS). FIGURE 2-14: Input Bias and Offset Currents vs. Common-Mode Input Voltage with TA = +85°C. FIGURE 2-15: Input Bias and Offset Currents vs. Common-Mode Input Voltage with TA = +125°C. 2.2 Other DC Voltages and Currents FIGURE 2-16: Output Voltage Headroom vs. Output Current. FIGURE 2-17: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-18: Output Short-Circuit Current vs. Power Supply Voltage. FIGURE 2-19: Supply Current vs. Power Supply Voltage. FIGURE 2-20: Supply Current vs. Common-Mode Input Voltage. 2.3 Frequency Response FIGURE 2-21: CMRR and PSRR vs. Frequency. FIGURE 2-22: Open-Loop Gain vs. Frequency. FIGURE 2-23: Gain-Bandwidth Product and Phase Margin vs. Ambient Temperature. FIGURE 2-24: Gain-Bandwidth Product and Phase Margin vs. Common-Mode Input Voltage. FIGURE 2-25: Gain-Bandwidth Product and Phase Margin vs. Output Voltage. FIGURE 2-26: Closed-Loop Output Impedance vs. Frequency. FIGURE 2-27: Gain Peaking vs. Normalized Capacitive Load. FIGURE 2-28: Channel-to-Channel Separation vs. Frequency. 2.4 Noise and Distortion FIGURE 2-29: Input Noise Voltage Density vs. Frequency. FIGURE 2-30: Input Noise Voltage Density vs. Input Common-Mode Voltage with f = 100 Hz. FIGURE 2-31: Input Noise Voltage Density vs. Input Common-Mode Voltage with f = 1 MHz. FIGURE 2-32: Input Noise vs. Time with 0.1 Hz Filter. FIGURE 2-33: THD+N vs. Frequency. 2.5 Time Response FIGURE 2-34: Non-Inverting Small Signal Step Response. FIGURE 2-35: Non-Inverting Large Signal Step Response. FIGURE 2-36: Inverting Small Signal Step Response. FIGURE 2-37: Inverting Large Signal Step Response. FIGURE 2-38: The MCP631/2/3/4/5/9 Family Shows No Input Phase Reversal With Overdrive. FIGURE 2-39: Slew Rate vs. Ambient Temperature. FIGURE 2-40: Maximum Output Voltage Swing vs. Frequency. 2.6 Chip Select Response FIGURE 2-41: CS Current vs. Power Supply Voltage. FIGURE 2-42: CS and Output Voltages vs. Time with VDD = 2.5V. FIGURE 2-43: CS and Output Voltages vs. Time with VDD = 5.5V. FIGURE 2-44: CS Hysteresis vs. Ambient Temperature. FIGURE 2-45: CS Turn-On Time vs. Ambient Temperature. FIGURE 2-46: CS Pull-Down Resistor (RPD) vs. Ambient Temperature. FIGURE 2-47: Quiescent Current in Shutdown vs. Power Supply Voltage. FIGURE 2-48: Output Leakage Current vs. Output Voltage. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Chip Select Digital Input (CS) 3.5 Exposed Thermal Pad (EP) 4.0 Applications 4.1 Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Unity-Gain Voltage Limitations for Linear Operation. 4.2 Rail-to-Rail Output FIGURE 4-4: Output Current. FIGURE 4-5: Diagram for Power Calculations. 4.3 Improving Stability FIGURE 4-6: Output Resistor, RISO, Stabilizes Large Capacitive Loads. FIGURE 4-7: Recommended RISO Values for Capacitive Loads. FIGURE 4-8: Amplifier with Parasitic Capacitance. FIGURE 4-9: Maximum Recommended RF vs. Gain. 4.4 MCP633, MCP635 and MCP639 Chip Select 4.5 Power Supply 4.6 High-Speed PCB Layout 4.7 Typical Applications FIGURE 4-10: Power Driver. FIGURE 4-11: Transimpedance Amplifier for an Optical Detector. FIGURE 4-12: H-Bridge Driver. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service