Datasheet MCP6291, MCP6291R, MCP6292, MCP6293, MCP6294, MCP6295 (Microchip)
Hersteller | Microchip |
Beschreibung | The Microchip Technology MCP6291/1R/2/3/4/5 family of operational amplifiers (op amps) provide wide bandwidth for the current |
Seiten / Seite | 36 / 1 — MCP6291/1R/2/3/4/5. 1.0 mA, 10 MHz Rail-to-Rail Op Amp. Features. … |
Dateiformat / Größe | PDF / 678 Kb |
Dokumentensprache | Englisch |
MCP6291/1R/2/3/4/5. 1.0 mA, 10 MHz Rail-to-Rail Op Amp. Features. Description. MCP6293. MCP6295. Applications. Design Aids
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MCP6291/1R/2/3/4/5 1.0 mA, 10 MHz Rail-to-Rail Op Amp Features Description
• Gain Bandwidth Product: 10 MHz (typical) The Microchip Technology Inc. MCP6291/1R/2/3/4/5 • Supply Current: I family of operational amplifiers (op amps) provide wide Q = 1.0 mA • Supply Voltage: 2.4V to 6.0V bandwidth for the current. This family has a 10 MHz Gain Bandwidth Product (GBWP) and a 65° phase • Rail-to-Rail Input/Output margin. This family also operates from a single supply • Extended Temperature Range: -40°C to +125°C voltage as low as 2.4V, while drawing 1 mA (typical) • Available in Single, Dual and Quad Packages quiescent current. In addition, the MCP6291/1R/2/3/4/5 • Single with CS (
MCP6293
) supports rail-to-rail input and output swing, with a • Dual with CS (
MCP6295
) common mode input voltage range of VDD + 300 mV to VSS – 300 mV. This family of operational amplifiers is
Applications
designed with Microchip’s advanced CMOS process. The MCP6295 has a Chip Select (CS) input for dual op • Automotive amps in an 8-pin package. This device is manufactured • Portable Equipment by cascading the two op amps, with the output of • Photodiode Amplifier op amp A being connected to the non-inverting input of • Analog Filters op amp B. The CS input puts the device in a Low-power • Notebooks and PDAs mode. • Battery-Powered Systems The MCP6291/1R/2/3/4/5 family operates over the Extended Temperature Range of -40°C to +125°C. It
Design Aids
also has a power supply range of 2.4V to 6.0V. • SPICE Macro Models • FilterLab® Software • Mindi™ Simulation Tool • MAPS (Microchip Advanced Part Selector) • Analog Demonstration and Evaluation Boards • Application Notes
Package Types MCP6291 MCP6291 MCP6291R MCP6292
PDIP, SOIC, MSOP PDIP, SOIC, MSOP SOT-23-5 SOT-23-5 NC 1 8 NC VOUTA 1 8 VDD VOUT 1 5 VDD VOUT 1 5 VSS V _ _ IN 2 - 7 VDD V 2 INA - + 7 VOUTB VSS 2 + VDD 2 + V - IN+ 3 + 6 VOUT - V 3 + _ INA+ - 6 VINB VIN+ 3 4 VIN– VIN+ 3 4 VIN– VSS 4 5 NC VSS 4 5 VINB+
MCP6293 MCP6293 MCP6294 MCP6295
PDIP, SOIC, MSOP SOT-23-6 PDIP, SOIC, TSSOP PDIP, SOIC, MSOP NC 1 8 CS VOUTA 1 14 VOUTD V V V 1 6 DD OUTA/VINB+ 1 8 VDD V _ OUT _ IN 2 - 7 VDD V 2 _ INA - + + - 13 VIND VSS 2 + 5 CS V _ 2 - + 7 V V INA OUTB IN+ 3 + 6 V - OUT V 3 12 INA+ VIND+ V V IN+ 3 4 V _ IN– 3 + - 6 V V INA+ INB SS 4 5 NC V 4 11 DD VSS VSS 4 5 CS V 5 10 INB+ VINC+ V _ _ INB 6 - + + - 9 VINC VOUTB 7 8 VOUTC © 2007 Microchip Technology Inc. DS21812E-page 1 Document Outline 1.0 Electrical Characteristics FIGURE 1-1: Timing Diagram for the Chip Select (CS) pin on the MCP6293 and MCP6295. 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Bias Current at TA = +85 ˚C. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 2.4V. FIGURE 2-4: Input Offset Voltage Drift. FIGURE 2-5: Input Bias Current at TA = +125 ˚C. FIGURE 2-6: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 5.5V. FIGURE 2-7: Input Offset Voltage vs. Output Voltage. FIGURE 2-8: CMRR, PSRR vs. Frequency. FIGURE 2-9: Input Bias, Offset Currents vs. Common Mode Input Voltage at TA = +85˚C. FIGURE 2-10: Input Bias, Input Offset Currents vs. Ambient Temperature. FIGURE 2-11: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-12: Input Bias, Offset Currents vs. Common Mode Input Voltage at TA = +125˚C. FIGURE 2-13: Quiescent Current vs. Power Supply Voltage. FIGURE 2-14: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-15: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-16: Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-17: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-18: Slew Rate vs. Ambient Temperature. FIGURE 2-19: Input Noise Voltage Density vs. Frequency. FIGURE 2-20: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-21: Quiescent Current vs. Chip Select (CS) Voltage at VDD = 2.4V (MCP6293 and MCP6295 only). FIGURE 2-22: Input Noise Voltage Density vs. Common Mode Input Voltage at 10 kHz. FIGURE 2-23: Channel-to-Channel Separation vs. Frequency (MCP6292, MCP6294 and MCP6295 only). FIGURE 2-24: Quiescent Current vs. Chip Select (CS) Voltage at VDD = 5.5V (MCP6293 and MCP6295 only). FIGURE 2-25: Large-Signal Non-inverting Pulse Response. FIGURE 2-26: Small-Signal Non-inverting Pulse Response. FIGURE 2-27: Chip Select (CS) to Amplifier Output Response Time at VDD = 2.4V (MCP6293 and MCP6295 only). FIGURE 2-28: Large-Signal Inverting Pulse Response. FIGURE 2-29: Small-Signal Inverting Pulse Response. FIGURE 2-30: Chip Select (CS) to Amplifier Output Response Time at VDD = 5.5V (MCP6293 and MCP6295 only). FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-32: The MCP6291/1R/2/3/4/5 Show No Phase Reversal. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table for Single Op Amps TABLE 3-2: Pin Function Table for Dual and Quad Op Amps 3.1 Analog Outputs 3.2 Analog Inputs 3.3 MCP6295’s VOUTA/VINB+ Pin 3.4 Chip Select Digital Input 3.5 Power Supply Pins 4.0 Application Information 4.1 Rail-to-Rail Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-3: Output Resistor, RISO stabilizes large capacitive loads. FIGURE 4-4: Recommended RISO Values for Capacitive Loads. 4.4 MCP629X Chip Select 4.5 Cascaded Dual Op Amps (MCP6295) FIGURE 4-5: Cascaded Gain Amplifier. 4.6 Supply Bypass 4.7 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.8 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.9 Application Circuits FIGURE 4-8: Multiple Feedback Low- Pass Filter. FIGURE 4-9: Photodiode Amplifier. FIGURE 4-10: Isolating the Load with a Buffer. FIGURE 4-11: Cascaded Gain Circuit Configuration. FIGURE 4-12: Difference Amplifier Circuit. FIGURE 4-13: Buffered Non-inverting Integrator with Chip Select. FIGURE 4-14: Integrator Circuit with Active Compensation. FIGURE 4-15: Second-Order Multiple Feedback Low-Pass Filter with an Extra Pole- Zero Pair. FIGURE 4-16: Second-Order Sallen-Key Low-Pass Filter with an Extra Pole-Zero Pair and Chip Select. FIGURE 4-17: Capacitorless Second-Order Low-Pass Filter with Chip Select. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Mindi™ Simulator Tool 5.4 MAPS (Microchip Advanced Part Selector) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information