Datasheet MCP6L1, MCP6L1R, MCP6L2, MCP6L4 (Microchip) - 7

HerstellerMicrochip
BeschreibungMCP6L1 operational amplifier (op amp) has a gain bandwidth product of 2.8 MHz with low typical operating current of 200uA and an offset voltage that is 1 mV (typ)
Seiten / Seite36 / 7 — MCP6L1/1R/2/4. Note:. 3.0. A 60. 2.5. oom. V 50. adr. /µs. 2.0. t (. e …
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MCP6L1/1R/2/4. Note:. 3.0. A 60. 2.5. oom. V 50. adr. /µs. 2.0. t (. e (V. rren. 1.5. u 30. 1.0. f O. lew Rat. p 20. S 0.5. atio o. Out 10. 0.0. -50. -25. 100. 125. 1.E. 1 -04

MCP6L1/1R/2/4 Note: 3.0 A 60 2.5 oom V 50 adr /µs 2.0 t ( e (V rren 1.5 u 30 1.0 f O lew Rat p 20 S 0.5 atio o Out 10 0.0 -50 -25 100 125 1.E 1 -04

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MCP6L1/1R/2/4 Note:
Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2, RL = 10 kto VL and CL = 60 pF.
70 3.0 )
VDD – VOH
A 60
IOUT
2.5 oom /m )
Falling Edge
V 50 adr m /µs e 2.0 t (
Rising Edge
H 40 e (V ut rren
V
1.5
OL – VSS
tp u 30 u
-IOUT
C 1.0 f O ut lew Rat p 20 S 0.5 atio o Out 10 R to 0.0 0 -50 -25 0 25 50 75 100 125 1.E 1 -04 00µ 1.E-03 1m 1.E- 10 02 m Output Current Magnitude (A) Ambient Temperature (°C) FIGURE 2-13:
Ratio of Output Voltage
FIGURE 2-16:
Slew Rate vs. Ambient Headroom to Output Current vs. Output Current. Temperature.
2.58 10
G = +1 V/V
)
V
P
DD = 5.5V
2.56 iv) P- /d 2.54 V g (V m in
VDD = 2.7V
2.52 w (20 e 1 2.50 age S ltag lt o 2.48 o t V t V 2.46 u tp tpu 2.44 Ou Ou 0.1 2.42 10k 100k 1M 0.E+00 1.E-06 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05 1.E+04 1.E+05 1.E+06 Time (1 µs/div) Frequency (Hz) FIGURE 2-14:
Small Signal, Non-Inverting
FIGURE 2-17:
Output Voltage Swing vs. Pulse Response. Frequency.
5.0
G = +1 V/V
4.5 ) 4.0 (V 3.5 e 3.0 ltag o 2.5 2.0 tput V 1.5 u O 1.0 0.5 0.0 0.E+00 1.E-06 2. E-06 3.E-06 4.E-06 5. E-06 6.E-06 7. E-06 8.E -06 9.E-06 1. E-05 Time (1 µs/div) FIGURE 2-15:
Large Signal, Non-Inverting Pulse Response.  2009-2012 Microchip Technology Inc. DS22135C-page 7 Document Outline MCP6L1/1R/2/4 - 2.8 MHz, 200 μA Op Amps 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuit FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage vs. Common-Mode Input Voltage at VDD = 2.7V. FIGURE 2-2: Input Offset Voltage vs. Common-Mode Input Voltage at VDD = 5.5V. FIGURE 2-3: Input Offset Voltage vs. Ambient Temperature. FIGURE 2-4: Input Common-Mode Range Voltage vs. Ambient Temperature. FIGURE 2-5: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-6: CMRR, PSRR vs. Frequency. FIGURE 2-7: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-8: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Frequency. FIGURE 2-10: The MCP6L1/1R/2/4 Show No Phase Reversal. FIGURE 2-11: Quiescent Current vs. Power Supply Voltage. FIGURE 2-12: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-13: Ratio of Output Voltage Headroom to Output Current vs. Output Current. FIGURE 2-14: Small Signal, Non-Inverting Pulse Response. FIGURE 2-15: Large Signal, Non-Inverting Pulse Response. FIGURE 2-16: Slew Rate vs. Ambient Temperature. FIGURE 2-17: Output Voltage Swing vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 4.0 Application Information 4.1 Inputs FIGURE 4-1: Protecting the Analog Inputs. FIGURE 4-2: Unity Gain Buffer has a Limited VOUT Range. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-3: Output Resistor, RISO, Stabilizes Large Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-4: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-5: Example Guard Ring Layout. 4.7 Application Circuits FIGURE 4-6: Sallen Key Topology. FIGURE 4-7: Multiple Feedback Topology. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service