Datasheet MCP6H01, MCP6H02, MCP6H04 (Microchip) - 7

HerstellerMicrochip
BeschreibungThe MCP6H01 operational amplifier (op amp) has a wide supply voltage range of 3.5V to 16V and rail-to-rail output operation
Seiten / Seite46 / 7 — MCP6H01/2/4. 2.0. TYPICAL PERFORMANCE CURVES. Note:. 21%. 1000. ces. TA = …
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MCP6H01/2/4. 2.0. TYPICAL PERFORMANCE CURVES. Note:. 21%. 1000. ces. TA = +125°C. 18%. 2550 Samples. 800. TA = +85°C. 600. ren. 15%. A = +25°C. 400

MCP6H01/2/4 2.0 TYPICAL PERFORMANCE CURVES Note: 21% 1000 ces TA = +125°C 18% 2550 Samples 800 TA = +85°C 600 ren 15% A = +25°C 400

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MCP6H01/2/4 2.0 TYPICAL PERFORMANCE CURVES Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note:
Unless otherwise indicated, T  A = +25°C, VDD = +3.5V to +16V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT VDD/2, VL = VDD/2, RL = 10 kto VL and CL = 60 pF.
21% 1000 ces ) TA = +125°C 18% 2550 Samples 800 V TA = +85°C 600 ren T 15% e A = +25°C 400 TA = -40°C ccu 12% ltag 200 f O o V 0 e o 9% -200 tag ffset 6% en -400 t O u V 3% p -600 DD = 5V erc Representative Part P In -800 0% -1000 .0 .5 .0 .5 .0 .5 0 5 0 5 0 5 0 -3 -2 -2 -1 -1 -0 0. 0. 1. 1. 2. 2. 3. -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Input Offset Voltage (mV) Common Mode Input Voltage (V) FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4:
Input Offset Voltage vs. Common Mode Input Voltage.
35% 1000 TA = +125°C ces 30% 2550 Samples ) 800 V T T µ A = +85°C ren A = - 40°C to +125°C 600 T 25% e ( A = +25°C g 400 TA = -40°C ccu 20% lta 200 f O o o V 0 e 15% g -200 ta ffset n 10% O -400 t VDD = 15V rce u -600 e 5% p Representative Part P In -800 0% -1000 6 4 2 0 -1 -1 -1 -1 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 -0.5 1.5 3.5 5.5 7.5 9.5 11.5 13.5 15.5 Input Offset Voltage Drift (µV/°C) Common Mode Input Voltage (V) FIGURE 2-2:
Input Offset Voltage Drift.
FIGURE 2-5:
Input Offset Voltage vs. Common Mode Input Voltage.
1000 1000 ) 800 TA = +125°C ) 800 Representative Part µV T 600 A = +85°C 600 V e ( TA = +25°C DD = 15V 400 T e (µV A = -40°C 400 ltag 200 o ltag 200 o V 0 V V 0 DD = 5V -200 ffset -200 ffset -400 t O V -400 u DD = 3.5V t O -600 p Representative Part u p -600 V In DD = 3.5V -800 In -800 -1000 -1000 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 0 2 4 6 8 10 12 14 16 Common Mode Input Voltage (V) Output Voltage (V) FIGURE 2-3:
Input Offset Voltage vs.
FIGURE 2-6:
Input Offset Voltage vs. Common Mode Input Voltage. Output Voltage.  2010-2011 Microchip Technology Inc. DS22243D-page 7 Document Outline 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-6: Input Offset Voltage vs. Output Voltage. FIGURE 2-7: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-10: CMRR, PSRR vs. Frequency. FIGURE 2-11: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-12: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-13: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-14: Quiescent Current vs. Ambient Temperature. FIGURE 2-15: Quiescent Current vs. Power Supply Voltage. FIGURE 2-16: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-17: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-19: Channel-to-Channel Separation vs. Frequency (MCP6H02 only). FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Output Current. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-29: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-30: Slew Rate vs. Ambient Temperature. FIGURE 2-31: Slew Rate vs. Ambient Temperature. FIGURE 2-32: Small Signal Non-Inverting Pulse Response. FIGURE 2-33: Small Signal Inverting Pulse Response. FIGURE 2-34: Large Signal Non-Inverting Pulse Response. FIGURE 2-35: Large Signal Inverting Pulse Response. FIGURE 2-36: The MCP6H01/2/4 Shows No Phase Reversal. FIGURE 2-37: Closed Loop Output Impedance vs. Frequency. FIGURE 2-38: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Application Information 4.1 Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Application Circuits FIGURE 4-8: High Side Current Sensing Using Difference Amplifier. FIGURE 4-9: Two Op Amp Instrumentation Amplifier. FIGURE 4-10: Photodetector Amplifier. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab Software 5.3 MAPS (Microchip Advanced Part Selector) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Corporate Office Atlanta Boston Chicago Cleveland Fax: 216-447-0643 Dallas Detroit Indianapolis Toronto Fax: 852-2401-3431 Australia - Sydney China - Beijing China - Shanghai India - Bangalore Korea - Daegu Korea - Seoul Singapore Taiwan - Taipei Fax: 43-7242-2244-393 Denmark - Copenhagen France - Paris Germany - Munich Italy - Milan Spain - Madrid UK - Wokingham Worldwide Sales and Service