Datasheet LTC6702 (Analog Devices) - 10
| Hersteller | Analog Devices |
| Beschreibung | Tiny Micropower, Low Voltage Dual Comparators |
| Seiten / Seite | 12 / 10 — PACKAGE DESCRIPTION. DC Package. 8-Lead Plastic DFN (2mm. 2mm) |
| Dateiformat / Größe | PDF / 369 Kb |
| Dokumentensprache | Englisch |
PACKAGE DESCRIPTION. DC Package. 8-Lead Plastic DFN (2mm. 2mm)
Modelllinie für dieses Datenblatt
- LTC6702CDC#PBF LTC6702CDC#TRMPBF LTC6702CDC#TRMPBF LTC6702CDC#TRPBF LTC6702CDC#TRPBF LTC6702CTS8#PBF LTC6702CTS8#TRMPBF LTC6702CTS8#TRMPBF LTC6702CTS8#TRPBF LTC6702CTS8#TRPBF LTC6702HDC#PBF LTC6702HDC#TRMPBF LTC6702HDC#TRMPBF LTC6702HDC#TRPBF LTC6702HDC#TRPBF LTC6702HTS8#PBF LTC6702HTS8#TRMPBF LTC6702HTS8#TRMPBF LTC6702HTS8#TRPBF LTC6702HTS8#TRPBF LTC6702IDC#PBF LTC6702IDC#TRMPBF LTC6702IDC#TRMPBF LTC6702IDC#TRPBF LTC6702IDC#TRPBF LTC6702ITS8#PBF LTC6702ITS8#TRMPBF LTC6702ITS8#TRMPBF LTC6702ITS8#TRPBF LTC6702ITS8#TRPBF
Textversion des Dokuments
LTC6702
PACKAGE DESCRIPTION DC Package 8-Lead Plastic DFN (2mm
×
2mm)
(Reference LTC DWG # 05-08-1719 Rev A) 0.70 p0.05 2.55 p0.05 0.64 p0.05 1.15 p0.05 (2 SIDES) PACKAGE OUTLINE 0.25 p 0.05 0.45 BSC 1.37 p0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 TYP R = 0.05 5 8 TYP 0.40 p 0.10 2.00 p0.10 0.64 p 0.10 PIN 1 NOTCH (4 SIDES) (2 SIDES) PIN 1 BAR R = 0.20 OR TOP MARK 0.25 s 45o (SEE NOTE 6) CHAMFER (DC8) DFN 0106 REVØ 4 1 0.23 p 0.05 0.200 REF 0.75 p0.05 0.45 BSC 1.37 p0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 6702fa 10
PACKAGE DESCRIPTION DC Package 8-Lead Plastic DFN (2mm
×
2mm)
(Reference LTC DWG # 05-08-1719 Rev A) 0.70 p0.05 2.55 p0.05 0.64 p0.05 1.15 p0.05 (2 SIDES) PACKAGE OUTLINE 0.25 p 0.05 0.45 BSC 1.37 p0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 TYP R = 0.05 5 8 TYP 0.40 p 0.10 2.00 p0.10 0.64 p 0.10 PIN 1 NOTCH (4 SIDES) (2 SIDES) PIN 1 BAR R = 0.20 OR TOP MARK 0.25 s 45o (SEE NOTE 6) CHAMFER (DC8) DFN 0106 REVØ 4 1 0.23 p 0.05 0.200 REF 0.75 p0.05 0.45 BSC 1.37 p0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 6702fa 10