Datasheet AD818 (Analog Devices) - 5

AD818 ABSOLUTE MAXIMUM RATINGS1 2.0 T
Supply Voltage . ± 18 V
J = 150 C 8-LEAD MINI-DIP PACKAGE
Internal Power Dissipation2 Plastic (N) . See Derating Curves
1.5
Small Outline (R) . See Derating Curves Input Voltage (Common Mode) . ± VS Differential Input Voltage . ± 6 V
1.0
Output Short-Circuit Duration . See Derating Curves Storage Temperature Range (N, R) . –65∞C to +125∞C Operating Temperature Range . –40∞C to +85∞C Lead Temperature Range (Soldering 10 sec) . 300∞C
0.5 8-LEAD SOIC PACKAGE
NOTES
MAXIMUM POWER DISSIPATION (W)
1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the
0
device at these or any other conditions above those indicated in the operational
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
section of this specification is not implied. Exposure to absolute maximum rating
AMBIENT TEMPERATURE (
ⴗ
C)
conditions for extended periods may affect device reliability. 2Specification is for device in free air: 8-lead plastic package, ␪JA = 90∞C/W; 8-lead Figure 3. Maximum Power Dissipation vs. Temperature SOIC package, ␪JA = 155∞C/W. for Different Package Types
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD818 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
METALLIZATION PHOTOGRAPH
Dimensions shown in inches and (mm)
OFFSET OFFSET NULL NULL +VS 1 8 7 –INPUT 2 0.0523 (1.33) 6 OUTPUT +INPUT 3 4 –VS 0.0559 (1.42)
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