Datasheet ES1C - Multicomp DIODE, ULTRAFAST, 1 A, 150 V, SMD — Datenblatt

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Manufacturer: Multicomp

Description: DIODE, ULTRAFAST, 1 A, 150 V, SMD

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Docket:
ES1 Series
Ultra Fast Recovery Power Diodes
Features:
· Glass passivated junction chip.

· For surface mounted application. · Low profile package. · Built-in strain relief. · Ideal for automated placement. · Easy pick and place. · Superfast recovery time for high efficiency. · High temperature soldering: 250°C/10 seconds at terminals.
Mechanical Data:

Specifications:

• Alternate Case Style: DO-214AC
• Current If @ Vf: 1 A
• Current Ifsm: 30 A
• Current Ir Max: 5 µA
• Diode Type: Fast Recovery
• External Depth: 2.83 mm
• External Length / Height: 2.61 mm
• External Width: 4.75 mm
• Forward Current If Max: 1 A
• Forward Current If(AV): 1 A
• Forward Surge Current Ifsm Max: 30 A
• Forward Voltage VF Max: 950 mV
• Forward Voltage: 950 mV
• Junction Temperature Tj Max: 150°C
• Junction Temperature Tj Min: -55°C
• Mounting Type: SMD
• Number of Pins: 2
• Operating Temperature Range: -55°C to +150°C
• Package / Case: DO-214AC
• Peak Forward Current: 1 A
• Repetitive Reverse Voltage Vrrm Max: 150 V
• Reverse Recovery Time trr Max: 35 ns
• Reverse Recovery Time trr Typ: 35 ns
• Reverse Voltage Vr Max: 950 mV
• SVHC: No SVHC (15-Dec-2010)
• Weight: 0.000068kg

RoHS: Yes