Plastic Packages for Integrated Circuits
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
L12.2.2x1.4A
D
6
INDEX AREA
2X A B 12 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
MILLIMETERS N E 0.10 C
1
2X 2 0.10 C MIN NOMINAL A 0.45 A1 -A3 TOP VIEW 0.10 C
C A1 A SYMBOL 0.05 C
LEADS COPLANARITY SIDE VIEW MAX NOTES 0.50 0.55 -0.05 -0.127 REF -b 0.15 0.20 0.25 5 D 2.15 2.20 2.25 -E 1.35 1.40 1.45 -e 0.40 BSC -k 0.20 -L 0.35 0.40 0.45 -N 12 2 Nd 3 3 Ne 3 3 Оё 0 -12 4
Rev. 0 12/06 NOTES: (DATUM A) 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. PIN #1 ID
1 2. N is the number of terminals. NX L 2 3. Nd and Ne refer to the number of terminals on D and E side, respectively. e Ne 4. All dimensions are in millimeters. Angles are in degrees. (DATUM B)
NX b 5
0.10 M C A B
0.05 M C Nd
3 5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.
7. Maximum package warpage is 0.05mm. …
