Package Intersil W6x6.36B — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W6x6.36B
36 Ball Wafer Level Chip Scale Package (WLCSP 0.35mm Pitch)
Rev 0, 1/16
X 2.439 В±0.030 0.350 Y 36x 0.241 В±0.030 F
E
D
2.439 В±0.030
C
B 0.3445 A
(4X) 0.10 1
PIN 1
(A1 CORNER) 2 5 4 6 0.1750 0.3445 BOTTOM VIEW TOP VIEW 0.250 3 Z PACKAGE
OUTLINE SEATING PLANE 0.05 Z 3 0.35 0.244 В±0.030
0.10
0.05 0.200
0.164 NOMINAL
0.364 В±0.0125
0.200 NOMINAL 6 NSMD
RECOMMENDED LAND PATTERN NOTES:
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