Package Intersil W5x7.35 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W5x7.35
35 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)
Rev 0, 11/14
0.400 X Y 2.14В±0.030 G
F 35x0.265В±0.035 E
D 2.88 В±0.030 C
B 0.240 A
(4X) 0.10 1 TOP VIEW 2 3 4 5 0.005 PIN 1 (A1 CORNER) 0.275 0.265
BOTTOM VIEW Z
0.240 0.05 Z PACKAGE OUTLINE SEATING PLANE
3 0.290 2
0.265В±0.035
0.10
0.05 0.400 4 6 NSMD 0.200В±0.030 RECOMMENDED LAND PATTERN
0.500В±0.050
SIDE VIEW NOTES:
1. Dimensions and tolerance per ASME Y 14.5M -1994.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z .
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
5. All dimensions are in millimeters.
6. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1 ZXY …