Package Intersil W5x5.25E — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W5x5.25E
5X5 ARRAY 25 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (With BSC)
Rev 0, 1/14 Y X 2.070 В± 0.030 25x 0.265 В± 0.035 E
D
1.600 C 2.330 В± 0.030 B
0.400
A
0.365
0.10 1 (4X) 2 3 4 5 0.400 PIN 1 (A1 CORNER)
TOP VIEW 0.235
BOTTOM VIEW SEATING PLANE Z 3 0.05 Z
PACKAGE OUTLINE
0.240 0.0400 BSC
(BACK SIDE COATING) 0.400 0.265 В± 0.035 0.10
0.05 0.290 ZXY
Z 3 NSMD
0.200 В± 0.03
TYPICAL RECOMMENDED LAND PATTERN
0.540 В± 0.050
SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimension and tolerance per ASMEY 14.5M-1994, …