Package Intersil W5x5.25 — Datenblatt

HerstellerIntersil
SerieWLCSP
ArtikelnummerW5x5.25
Package Intersil W5x5.25

5x5 Array 25 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

PDF, 121 Kb
Auszug aus dem Dokument

Parameter

FamilyWLCSP-BP
Pin Count25
Length2.60 mm
Width2.60 mm
Weight0.007189941 g
Pitch0.50 mm
Lead Free Peak Temperature260 °C
Package IndexW5X5.25

Modellreihe

Herstellerklassifikation

  • Plastic Packages