Package Intersil W4x7.28 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x7.28
28 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)
Rev 0, 04/16
Y X 1.660 В±0.030 0.400
G
28x 0.265 В±0.035 F
E 2.860 В±0.030 D
C
B
A (4X) 0.23
1 0.10 2 3 4 0.200 PIN 1
(A1 CORNER) 0.23 TOP VIEW BOTTOM VIEW 0.05 Z PACKAGE OUTLINE 0.215 Z SEATING PLANE
3 0.400
0.265 2
0.265 В±0.035
0.10 M Z X Y
0.05 M Z
4 NSMD 0.200 В±0.030 6 NSMD
RECOMMENDED LAND PATTERN 0.500 В±0.050
SIDE VIEW NOTES:
1.
2. …