Package Intersil W4x5.20S — Datenblatt

HerstellerIntersil
SerieWLCSP
ArtikelnummerW4x5.20S
Package Intersil W4x5.20S

20 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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Parameter

FamilyWLCSP-BP
Pin Count20
Length2.34 mm
Width1.60 mm
Height max0.53 mm
Weight0.0040 g
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW4X5.20S

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