Package Intersil W4x5.20R — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x5.20R
20 I/O ULTRA THIN WAFER LEVEL CHIP SCALE PACKAGE (NO SOLDER BALL) WLCSP 0.4mm pitch
Rev 0, 12/16 X
Y 0.400 1.74 В±0.030 E
20X 0.240 В±0.005
2.15 В±0.030 D
C B
A
0.275
(4X) 0.10 1
TOP VIEW PIN 1
(A1 CORNER) 2 3 4 0.200
0.270
BOTTOM VIEW 0.240 В±0.005
2 NOTES:
1. Dimensions and tolerance per ASMEY 14.5 -1994.
2. I/O position designation per JESD 95-1, SPP-010.
3. All dimensions are in millimeters. 1 0.228 В±0.020
SIDE VIEW …