Package Intersil W4x5.20M — Datenblatt

HerstellerIntersil
SerieWLCSP
ArtikelnummerW4x5.20M
Package Intersil W4x5.20M

20 BALL WAFER LEVEL CHIP SCALE PAKET (WLCSP 0,4 mm PITCH)

Package Outline Drawing (POD)

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Parameter

FamilyWLCSP-TKCURDL
Pin Count20
Length2.15 mm
Width1.74 mm
Thickness0.50 mm
Height max0.55 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW4X5.20M

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