Package Intersil W4x5.20K — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x5.20K
20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 0, 8/14
1.200 X Y 1.82В±0.030 0.400 E 20x 0.265В±0.035
2.15В±0.030 D C 1.600 B 0.275 A
(4X) 0.10
1 2 4 3 0.310 TOP VIEW 0.200 PIN 1
(A1 CORNER) BOTTOM VIEW Z
0.05 Z PACKAGE
OUTLINE SEATING PLANE
3 0.240 0.290
0.400 0.265В±0.035
0.10
0.05 ZXY
Z 0.200В±0.030
RECOMMENDED LAND PATTERN 0.500В±0.050
SIDE VIEW NOTES:
1. Dimensions and tolerance per ASME Y 14.5M -1994.
2. Dimension is measured at the maximum bump diameter
parallel to primary datum Z .
3. Primary datum Z and seating plane are defined by the spherical
crowns of the bump. …