Package Intersil W4x5.20J — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x5.20J
20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch) пЂ 
Rev 1, 1/15 X
Y 0.400 1.64 В± 0.030 E
D 20x 0.265 В±0.035
2.18 В±0.030 C
B
A (4X) 0.10
PIN 1
(A1 CORNER) TOP VIEW 0.290
1 2 3 4 0.200 0.220
BOTTOM VIEW Z
0.240 0.05 Z PACKAGE OUTLINE SEATING PLANE
3 0.400
0.290 2
0.265 В±0.035 x20
0.10
0.05 Z X Y
Z 4 0.200 В±0.030 6 NSMD 0.500 В±0.050 RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
1. Dimensions and tolerance per ASMEY 14.5 -1994.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. …