Package Intersil W4x5.20H — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x5.20H
20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
Rev 0, 05/14 1.200
X Y 0.400 1.67В±0.030
E
D 20x 0.265В±0.035 C 2.07В±0.030 1.600 B 0.235 A
(4X) 0.10 1
0.200
TOP VIEW 2 3 4
0.235 PIN 1
(A1 CORNER) BOTTOM VIEW PACKAGE
OUTLINE Z
0.05 Z 0.240 SEATING PLANE
3 0.400
0.265В±0.035 x20 0.290 0.10
0.05 ZXY
Z 0.200В±0.030
0.500В±0.050 RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
1. Dimensions and tolerance per ASME Y 14.5M -1994.
2. Dimension is measured at the maximum bump diameter
parallel to primary datum Z .
3. Primary datum Z and seating plane are defined by the spherical …